Indium Solder Testing & Analysis for Solder Pots (Part No. OT98885)

Indium Solder Testing & Analysis
The fast-track method for solder analysis.

Features:
• Test for solder pot contamination
• Test includes all metals specified in J-STD-006C. This includes Tin, Lead, Silver, Copper, Bismuth, Antimony, Aluminum, Arsenic, Gold, Cadmium, Iron, Indium, Nickel and Zinc. Lead is measured and reported when at the impurity level but reported as " Balance" in traditional leaded alloys.
• Avoid soldering problems such as icicling, bridging, pin-holing, webbing, dull connections and grittiness.
• Each analytical report is reviewed by the Analytical Laboratory to determine the quality of the solder.
• The analytical report is e-mailed within 7 working days after receipt of the solder sample.

Product Coontents:
• Sample-mailer envelope includes documentation, shipping label and instructions for sending the solder sample.