The “44” flux residues are non-conductive and non-corrosive. Residue removal would normally be for cosmetic reasons. If the assembly is in a heated environment and sees temperatures of over 160°F the flux residues will re-melt. When liquid (at high temperatures) the residues are conductive.
Archive for the ‘Process’ Category
Are Kester “44” rosin residues harmful to an assembly?
Thursday, August 27th, 2015Do rosin flux residues need to be removed?
Thursday, August 27th, 2015Rosin flux residues are non-conductive and non-corrosive. Under normal circumstances they do not have to be removed from a printed circuit assembly. Rosin residue removal would be for cosmetic considerations. In an environment where the working temperature of the assembly will exceed 200°F the rosin residues will melt and become conductive, in these situations flux removal is required.
Source: Kester Solder
Solder Materials and Compounds for LEDs
Wednesday, August 26th, 2015
Indium Corporation provides a myriad of materials for Light Emitting Diode (LED) manufacturing. From gallium trichloride for MOCVD precursors to thermal interface materials, no other materials company provides so many solutions in so many layers of the ever-advancing LED.
Compounds
We provide indium trichloride and gallium trichloride for manufacturing common MOCVD precursor materials (TMI and TMG, respectively) for LEDs.
Indium Corporation specializes in supplying IN and Ga compounds at high purity, in large volume, and around the globe.
Thermal Interface
Indium Corporation is the world’s largest supplier of metal TIMs. We offer a wide selection of metal-based TIMs for reflow or compression. Our patented Heat-Spring® compressible interface material at 86W/mK conductivity can solve many thermal interface issues. The standard pack for Heat-Springs® is tape & reel and it is designed for both automated or hand assembly applications.
Our TIMs are used like a standard thermal pad. They have no residue and zero outgassing properties. Heat-Springs® are provided in custom or standard off-the-shelf shapes.
Surface Mount Assembly and Solder Fortification
Indium solder pastes for LED deliver ultra-low voiding and clear residues.
- L-220 for Pb-free (SAC305) applications
- L-180 for Sn63 applications
Indium Corporation also provides solder preform chips in tape & reel right off the shelf to help with solder starvation. It is easy to add bulk solder with preforms. We also provide solder preform washers and flux-coated preforms for soldering connectors to packages.
Wave Soldering Materials and Rework
- Sn995 and Sn63 Bar Solder
- WF-9940 and WF-7745 (VOC Free) Wave Flux
- Cw-207 Cored Wire—Pb and Pb-free flux-cored rework wire; clear residue; RA type flux.
Die-Attach and Fluxes
For LED companies needing high temperature die-attach materials,
Indium Corporation is a global provider of solder paste, wire, and high purity AuSn preforms for fluxless die-attach.
For companies in need of materials for bumping wafers or soldering pre-plated dies for flip-chip, Indium Corporation provides “semiconductor grade” solder pastes and fluxes.
NanoBond®
NanoBond®, a joining process using NanoFoil®, is used to bond the thermal pad on LEDs to the heat-sinking substrates. NanoBond® eliminates the need for the conventional reflow of LEDs, resulting in improved brightness and color, and extended lifetime. When combined with conventional assembly techniques, NanoBond® produces superior thermal performances as compared to thermal epoxies.
NanoFoil® is a self-contained, localized heat source that can be used to solder bond electronics packages to substrate materials. NanoFoil® is a RoHS compliant material consisting of hundreds of alternating nanoscale layers of aluminum and nickel. Once activated, the heat can melt adjacent solder layers to join components together with minimal thermal exposure of the components.
Source: Indium Corporation
Electronics Assembly
Friday, August 21st, 2015Electronics Assembly
From diagnostic and imaging equipment to hand-held monitoring devices, printed circuit boards are in almost all of the equipment used by doctors, hospitals and clinics.
- Smaller components in smaller devices require solder materials that provide good electrical contacts with no bridging, excellent wetting and good throughput.
- In order to achieve maximum functionality in increasingly smaller spaces, the use of flexible circuit boards is increasing, providing new challenges for electronic assembly.
- Connectors need to be securely soldered to the circuit board to withstand constant use.
Product Characteristics
Paste
- Spherical, low-oxide powder available in various mesh sizes
- Pb-free, Pb-containing, AuSn and indium-containing alloys
- No-clean, water or solvent cleanable flux vehicles
- Flexible packaging and quantities to support manufacturing requirements
Wire
- Diameters available in SnAg and AuSn down to 0.001″
- Pb-free, Pb-containing, AuSn and indium-containing alloys
- Solid core and flux core
Fluxes
- Flux #2 and #3 for removing tenacious oxides from metals such as Nininol and stainless steel
- No-clean and water soluble Tacflux
Preforms
- A large die library of washers, squares, discs, frames and special shapes
- InTEGRATED™ Preforms used for fast placement of multiple washers at once
- Pb-free, Pb-containing, AuSn and indium-containing alloys
- Flux coatings
- Small sizes, variable thicknesses to achieve optimum volume
- Flexible packaging and quantities to support manufacturing requirements
Spheres
- Alloys: SAC and Pb-contained alloys as well as indium-contained
- Standard sizes are 300 to 1270 microns. Other sizes may be available on request.
- Tolerances as tight as ±5 microns for uniform alignment
| Soldering Process | Description | Challenges | Our Recommended Products |
|---|---|---|---|
| Surface Mount Reflow | Standard process for PCB assembly | Flexible circuits and smaller boards and components require no bridging and excellent wetting |
|
| Laser Soldering | Non-contact; highly controlled heating | Identifying the proper power and timing to reduce voiding and flux spatter and optimize wetting |
|
| IR Soldering | Can be used for smaller packages such as chip resistors, capacitors and SOICs and high temperature soldering | Larger components may impede heating of smaller components due to shadowing effect |
|
| Induction Soldering | Localized, uniform heating | Requires proper set up and design with a repeatable process to introduce the parts being soldered |
|
| Vacuum Soldering | Reduction in pressure allows voids in solder to escape prior to reflow, creating much lower voiding in finished solder joint | Batch process may be too slow for high volume manufacturing. Requires proper set up, design and material selection |
|
| Vapor Phase Soldering | Vapor chamber allows for uniform heating across the entire assembly | Fast wetting forces may cause tombstoning with common chip and resistors, which can be minimized with preheat |
|
| Manual Soldering | Using a heat gun, soldering iron or other hand-held heat source to reflow the solder | Operator-to-operator solder volume variance |
|
Source: Indium Corporation, Clinton, NY
Rework and Touch-Up
Friday, August 21st, 2015Indium Corporation manufactures a variety of materials for PCB rework, repair, and touch up, including flux-cored wire, liquid rework fluxes, and TACFluxes®.
Flux Cored Wire
Indium Corporation has developed a range of flux-cored wire solutions to meet the needs of virtually every electronic assembly and rework operation from no-clean flux-cored wire for circuit board assembly to activated flux-cored wire for non-sensitive electronics and electrical applications.
No-clean fluxes include:
- CW-807 halogen free for high reliability assemblies
- CW-807M, which has a small addition of halogen activator for more difficult to solder assemblies
- CW-807H for high temperature alloys
- CW-501 is rosin (colophony) free and shows exceptional soldering on a wide range of assemblies
- CW-802 is recommended only when no halogen is a must and the process is well-controlled
Activated fluxes include:
- CW-201, a traditional RA type flux as defined by the legacy Mil-Spec QQ-S-571
- CW-207 formulated using a blend of heat stable clear rosins
- CW-209, which has twice the amount of halogen activator as CW-207
- CW-501, rosin (colophony) free and has exceptionally effective soldering on a wide range of assemblies
Liquid Rework Fluxes
Liquid rework fluxes are packaged in convenient pen dispensers, providing the optimal fluxing with no waste. Flux pens utilize a spring-loaded applicator tip to deliver a controlled amount of flux to the work surface. The user friendly pin-point application is deal for touch-up and light assembly work. Liquid fluxes include:
- FP-500, a halogen-free flux that is compatible with both SnPb and Pb-free assemblies
- NC-771, a halogen-free, low-residue, all-purpose flux that passes the SIR test in the un-reflowed state
- FP-300, a water-soluble flux that is compatible with both SnPb and Pb-free assemblies
TACFluxes®
TACFluxes® have a variety of uses including rework and repair of various electronics assemblies and components, SMT component attach (including BGAs and flip-chips), BGA ball attach, preform soldering, and virtually any application where flux is required. Indium Corporation manufactures a complete line of TACFlux®, which include no-clean, water-wash, and RMA-based fluxes.
Some of the most common TACFluxes® include:
- TacFlux 089: no-clean flux for Pb-free alloys
- TacFlux 089HF: a halogen-free, no-clean flux for Pb-free alloys
- TacFlux 025: a water-soluble flux for Pb-free and SnPb alloys
- TacFlux 020B: a halogen-free, no-clean flux for Pb-free alloy
Source: Indium Corporation, Clinton, NY
Low Temperature Alloy Solders
Friday, August 21st, 2015References:
Liquid metal alloys are shipped in polyethylene bottles.
Storage/Shelf Life for Liquid Metal Alloys
Unopened bottles have a guaranteed shelf life of one year. It is recommended that the volume be replaced with dry argon as the material is removed from the bottle. This will minimize any possibility of oxidation on the surface of the alloy. If the alloy has been stored below its melting point and has solidified, it should be remelted and thoroughly shaken or mixed before use.
bismuth low-temperature melt solder
Source: Carol Gowan, Indium Solder Co.
5 Solder Families and How They Work
Friday, August 21st, 2015Source: Indium Solder Co.
Solder is critical material that physically holds electronic assemblies together while allowing the various components to expand and contract, to dissipate heat and to transmit electrical signals. Without solder, it would be impossible to produce the countless electronic devices that define the 21st century.
Solder is available in numerous shapes and alloys. Each has its particular properties, providing a solder for nearly every application. Many times, solder is an afterthought in the design and engineering process. However, by considering the soldering step early in the design process, problems can be minimized. In fact, with the proper information, the characteristics of a solder can be part of an optimal design.
Solders for assembly of electronic devices melt at temperatures below 350ºC (660 F), and typically bond two or more metallic surfaces. The elements commonly alloyed in solders include tin (Sn), lead (Pb), antimony (Sb), bismuth (Bi), indium (In), gold (Au), silver (Ag), zinc (Zn), and copper (Cu).
Another material commonly used in soldering is flux. The primary function of flux is to remove existing oxides on the solder itself and on the metallic surfaces being bonded, and to protect these metals from further oxidation while at the high tem-peratures of the soldering operation. Fluxes typi-cally contain rosin and/or resin, and organic acids and/or halides, which are combined to produce the appropriate fluxing strength for a particular metallization..
Electronic solders can be grouped into the fol-lowing five families: tin/lead, lead-free, indium/ lead, low-temperature, and high-temperature. This article discusses these five alloy families, and several members of each family. It also describes the wide variety of solder forms.
Tin/lead solder alloys
Tin/lead alloys are the fundamental solders, with a history dating back to the early days of radio. This alloy family consists of three basic compositions that have melting points in the 180 C (355 F) region:
• 63Sn/37Pb: the eutectic composition with a melting point of 183 C (361 F). The term “eutectic”
indicates that the composition produces an alloy with a distinct melting point, versus a melting range.
• 60Sn/40Pb: a variation from the eutectic, with a melting range of 183 to 188 C (361 to 370 F)
• 62Sn/36Pb/2Ag: a composition that is often chosen for silver metallizations, with a melting point of 179 C (354 F).
These alloys have reasonable melting points, ad-equate wettability and strength, and low cost. Therefore, they account for perhaps 80 to 90% of all solders in electronics assembly. The perform-ance of these alloys is so well understood and doc-umented that the electronics assembly industry has designed and engineered products based on their properties.
Increasing the lead content and reducing the tin content results in solders with substantially higher melting points. Common versions are:
• 90Pb/10Sn: has a melting range of 275 to 302 C (527 to 575 F).
• 95Pb/5Sn: has a melting range of 308 to 312 C (586 to 593 F).
Solder preforms are available in a wide range of shapes and sizes, primarily for surface mount technology.
These alloys solder the terminations within elec-tronic components. High melting-point solders prevent the solder joint within the component from re-melting when the component is subsequently sol-dered to the printed circuit board (PCB), a step that typically involves the lower melting-point 63Sn/37Pb solder. High lead-containing solders, in general, have better fatigue performance, higher tensile strengths, and slightly reduced wettability when compared to the lower melting-point tin-lead compositions. Reducing-gas atmospheres, such as forming gas or pure hydrogen, are effective fluxing agents at these high soldering temperatures, and often substitute for chemical fluxes that may char at high soldering temperatures.
In spite of all the beneficial attributes and familiarity associated with these alloys, the presence of lead, and its potential environmental impact when products are discarded to landfills, has caused the industry to seek lead-free alternatives.
Lead-free solder alloys
Legislation in Europe will ban lead-containing solders, with a few exceptions, effective 01 July 2006. As a result, manufacturers, regardless of location, will have to comply if they plan to sell electronic products into Europe after the deadline.
Lead-free alloy development (for replacing Sn/Pb alloys) has largely focused on a group of al-loys that have become known by the acronym “SAC” for its Sn/Ag/Cu (tin-silver-copper) com-position. SAC alloys have compositions that range from 3.0% to 4.0% silver, and from 0.5% to 0.8% copper, with the balance tin. They are generally regarded as eutectic, or nearly eutectic, at ~217ºC (422 F).
It has been suggested that the properties of tin-bismuth-silver alloys are better than those of the SAC alloys, because they exhibit improved wetta-bility and fatigue resistance. However, tin-bismuth-silver solders do have some drawbacks. When combined with a lead-containing solder metallization, on the PCB or the component terminations, a small amount of tin-lead-bismuth eutectic alloy will form. This resultant alloy has a melting temperature of only 96ºC (204 F)! Because many temperature-cycling regimens do cycle up to 125ºC (257ºF), this presents an obvious problem. As a result, tin-bismuth-silver has been abandoned until the electronics industry is certain that all lead has been “purged” from electronics manufacturing. This is expected to take at least five or ten years.
Lead-free alloys, with all of their “environmentally friendly” hype, come with a few “issues” of their own:
•Higher melting temperature: The ~35ºC (63 F) higher melting temperature (vs. eutectic tin-lead) has to be considered in component and assembly design. Standard solder processing temperatures of 240 to 260ºC (464 to 500 F), associated with SAC alloys, can damage “standard” electronic compo-nents that are rated up to only 235ºC (455 F) be-cause they were designed for eutectic tin-lead. This higher processing temperature also results in higher manufacturing cost due to the extra energy needed to operate equipment at these higher temperatures.
• Greater fuel consumption: More energy means higher fuel consumption, which in turn means more pollution. Thus, the environmental benefit of lead-free alloys is somewhat mitigated.
These are solder balls on a ball grid array (bga)
• Multiple soldering steps: The other main issue revolves around the high-lead alloys (>85% Pb) that are often needed in assemblies requiring multiple soldering steps. These high-lead compositions melt in the 245 to 327ºC (473 to 620 F) range. To date, the only lead-free alloy that can exist at these higher temperatures is 80Au/20Sn (eutectic at 280ºC, 536 F). The gold cost associated with this alloy, and the fact that no lower-cost alternative lead-free compositions exist, has forced the industry to recon-sider a total ban on lead. As a result, the European lead-free legislation exempts lead-bearing alloys that contain 85% or more lead. Certain defense, telecommunications, and space applications are also exempt from lead restrictions.
Other lower melting-point lead-free alloys that are of some interest include 58Bi/42Sn (138ºC, 281ºF); Bi/Sn/Ag (~140ºC,~284ºF); and In/Sn (118ºC, 244ºF). They offer alternatives for appli-cations with temperature-sensitive components and materials. They also serve well in step-sol-dering applications in which the first level of as-sembly may have been constructed with a SAC alloy.
Low-temperature alloys
When added to various solder alloys, both in-dium and bismuth reduce the melting point. Ad-ditionally, high indium-containing, low melting-point solders have good ductility that often can compensate for mismatches in the coefficient of thermal expansion (CTE) between component and board materials.
Low temperature solders are useful in the sol-dering of temperature-sensitive components or sub-strates, as well as in step soldering. Step soldering is the process in which an initial soldering step is made with a relatively high-melting point alloy, followed by a soldering step with a lower-melting point alloy that can be applied without re-melting the previously soldered joints.
Examples of low-melting point solders are:
•52In/48Sn: a eutectic alloy with a melting point of 118 C (244 F).
• 58Bi/42Sn: a eutectic alloy with a melting point of 138 C (281 F).
• 80In/15Pb/5Ag: melting range of 142 to 149 C (287 to 300 F).
High-temperature solder alloys
In addition to the 90Pb/10Sn and 95Pb/5Sn sol-ders discussed earlier, other high-temperature sol-ders have melting points in the 300 C range. For example, 80Au/20Sn is a eutectic composition having a melting point of 280 C (536 F). This high tensile-strength, precious metal solder is often se-lected for the “gold to gold” sealing of large pack-ages. When processed in an inert gas environment such as nitrogen, this solder has the advantage of requiring no flux when soldering to two gold metallizations.
The alloy 92.5Pb/5.0In/2.5Ag has a melting range of 300 to 310 C (572 to 590 F). This solder has excellent thermal fatigue properties and is fre-quently chosen for applications in which the elec-tronic assembly is subjected to large thermal ex-cursions.
Indium-lead for thick gold metallizations
Anyone who spends time perusing the various solder compositions will quickly realize that tin is one of the main constituents in most solders. How-ever, tin has an affinity for alloying with precious metals such as gold. Studies indicate that 63Sn/37Pb at 200ºC (392 F) will dissolve one mi-cron (~40 micro-inches) of gold/second/unit area. As tin reacts with gold, a brittle Au/Sn intermetallic forms. When the concentration is high enough, these intermetallics have a deleterious effect on the thermal fatigue characteristics of the joint, and make it susceptible to fracture during thermal cycling.
For tin-bearing solders in applications with gold-plated materials, it is advisable to keep the gold layer thin, < 0.38 (15 micro-inches), thereby reducing the concentration of Au/Sn intermetallic that can form. However, many applications such as optoelectronics packages and defense/space electronics call for thicker gold metallizations. In such scenarios, in which the need for reliability is high, tin-bearing solders are not appropriate.
Unlike tin, indium has a much lower affinity for precious metals and dissolves gold at a rate 13 to 14 times slower than tin. Also, in devices with operational temperatures below 125ºC (257 F), the intermetallic that forms between indium and gold is of a much more compliant and ductile nature, and is not susceptible to embrittlement.
Therefore, the family of In/Pb solders is beneficial when soldering against thick gold film metallizations. The In/Pb alloys are a solid solution system in which the liquidus and solidus temperatures are close for all compositions (near-eutectic at all compositions). The indium-lead system offers alloys of varying melting points, with indium-rich compositions having a lower melting range, and the lead-rich compositions having a higher melting range. For examples: 70In/30Pb has a melting range of 165 to 175 C (329 to 347 F), and 81Pb/19In has a melting range of 260 to 275 C (500 to 527 F).
Solder is typically provided in these common forms:
• Bar/Ingot: Typically cast and used in solder pot or wave sol-dering applications.
• Shot: Small tear-drop shaped pieces of alloy. The relatively small size offers flexibility in applications in which the alloy has to be weighed to a particular amount, such as filling crucibles for vapor deposition.
• Spheres: Also called precision solder balls, spheres are supplied with diameters from 0.012 to 0.032 in. They are deposited as bumps on elec-tronic packages such as BGAs (ball grid arrays).
• Ribbon and foil: Typically thin (0.002 to 0.010 in.+ thick) pieces of solder, foil often has a square or rectangular geometry. Ribbon, on the other hand, is more of a long, narrow strip wrapped on a spool. Both can be hand cut to form simple preforms or to make shims and thermal interfaces.
• Wire: Often applied in rework or cut to lengths and formed into rings or other simple shapes, wire diameters typically range from 0.010 to 0.030 in. However, smaller and larger diameters are available, de-pending on the alloy. Solder wire can be produced with a flux core.
• Preforms: Typically punched, these thin pieces of solder are manu-factured as squares, rectangles, frames, disks, washers, and custom geome-tries. Solder preforms can be applied in surface mount technology (SMT), which is common to the manufacture of most consumer electronics such as cellular phones and computers. Preforms separately attach a component to a pad, or they augment the solder volume of the solder paste. Washers serve as pin connectors or other through-hole components.
• Paste: A mixture of prealloyed spherical solder powder with a flux/vehicle to form a pasty material. Paste is dispensed or stencil-printed onto the metallization pads of a printed circuit board, and components are automatically placed onto the solder paste. The tacky nature of the solder paste temporarily holds the components in place. The printed circuit board is then reflow soldered, attaching the components to the pads. Solder pastes are available with RMA, no-clean, and water-soluble flux vehicle formulations.
Selected lead-free solder alloys
1E 52In/48Sn (118°C) (Eutectic) — Lowest melting-point practical solder.
281 58Bi/42Sn (138°C) (Eutectic) — Good thermal fatigue performance;
established history.
227 77.2Sn/20.0In/2.8Ag (175°C) 187 — Not for use over 100 C due to Sn/In eutectic at 118° C.
254 86.9Sn/10.0In/3.1Ag (204°C) 205 No Sn/In eutectic problem; potential use for flip chip assembly.
241 95.5Sn/3.8Ag/0.7Cu (217-218°C) (Eutectic) — Common lead-free alloys.
246 95.5Sn/4.0 Ag/0.5Cu (217-218°C) (Eutectic) — Petzow (German) prior art reference makes this alloy patent-free.
2521 95.5Sn/3.9Ag/0.6Cu 217-218°C) (Eutectic) — NEMI promoted alloy (average composition of Indalloy #241 and #246).
249 91.8Sn/3.4Ag/4.8Bi (211°C) 213 –board and component metallizations must be lead-free.
121 96.5Sn/3.5Ag (221°C) (Eutectic) — Binary solder has history of use, marginal wetting.
244 99.3Sn/0.7Cu (227°C) (Eutectic) — Inexpensive, possible use in wave soldering.
133 95Sn/5Sb (235°C) 240 — —
209 65Sn/25Ag/10Sb (233°C) (Melting point) — Die attach solder, very brittle.
Note: Alloy of choice for general SMT assembly; 2. ICA patent; 3. ICA licensed Sandia patent.
Source: Eric Bastow is a Technical Support Engineer at Indium Corp. of America, Web site: www. indium.com.
Indium PoP Flux vs. PoP Paste: Which one is best?
Friday, August 21st, 2015Indium PoP Flux vs. PoP Paste: Which one is best?
I have recieved a number of inquiries over the years regarding the Pack-on-Package (PoP) Manufacturing Processes. One of the most frequent questions that I have recieved is whether to use a PoP flux or a PoP solder paste.
Most people use a PoP flux because it is a much easier process to set-up and maintain. However, there are advantages to using PoP solder paste as well. When using components that exhibit high warpage levels, PoP solder paste will allow you to bridge the gap between the top and the bottom component while the warpage is occuring. Flux may be able to bridge the gap; however, there is no powder alloy present to create an alloy gap filler if the solder bump on the top package reaches the solidus point before the component warps back to the original level and makes contact with the bottom package. his would result in a “Snowman” Defect because there is not alloy present to bridge the gap. The Snowman Defect is another warpage-induced defect similar to Head-in-Pillow (HiP) or Non-Wet-Open (NWO), but there is no paste printed on the bottom substrate.
The PoP solder paste dipping process takes far more time and effort to set-up and maintain. For example, with paste, you have to make sure the dipping dwell time and dip depth is optimized perfectly for the component that you are dipping. If too much PoP solder paste is applied to the bottom of the component (component bumps), bridging can occur even before the component is placed on the bottom package. If too little PoP solder paste is present, there may not be enough flux there to create a proper solder joint.
The PoP Flux process is far more forgiving and presents a wider process window, as long as component warpage isn’t a concern.
I will talk more about the PoP dipping process set-up, optimization, and maintenance in future blog posts.
– See more at: http://www.indium.com/blog/pop-flux-vs-pop-paste.php#sthash.5Hqcxv4e.dpuf
Source: Indium Corporation, 2015
Chemtronics QBE Cleaning System for End-Face Cleaning
Thursday, August 20th, 2015Using the QbE™ Cleaning System for End-Face Cleaning
1. What is the QbE Cleaning System?
The QbE Cleaning System is the precision wipe platform for cleaning fiber optic end-faces. This new fiber optic cleaning device
enables the user to clean fiber end-faces in either a “dry’ mode, or “wet” mode using a cleaning solvent, without damaging the
end-face.
2. How was the QbE Cleaning System developed?
The QbE Cleaning System was developed after three years of development with end users who expressed concerns regarding the
cleaning of end-faces. The QbE Cleaning System satisfies these concerns with an easy-to-use dispensing container, which carries
its own cleaning platen.
3. What advantages does the QbE Cleaning System have over other end-face cleaning
methods currently in use?
Features:
■ Complete fiber end-face cleaning system
■ Effective “wet” or “dry” connector cleaning
■ Provides the ideal cleaning surface
■ Convenient size
■ Heavy-duty lint-free wiping material enough for all end-face cleaning
■ Patent pending
Benefits
■ No refills to buy or investment in expensive mechanisms
■ Only system that allows both cleaning options
■ The QbE platen is perfect for outside plant and OEM applications
■ Portable cleaning system is perfect for tool kits and has best “foot print” for workbenches
■ Won’t shred or tear — tough enough to remove buffer gel, safe
■ Unique, easy-to-use cleaning device
4. How is the QbE Cleaning System constructed?
Each QbE Cleaning System contains 200 individual wipes on a roll. Each wipe is perforated for easy use and disposal, so there is always a clean wipe available for each end-face to be cleaned. The sides of the 3-inch cube container are reinforced, and each QbE Cleaning System comes with an attached neoprene cleaning platen. The cleaning platen insures that the cleaning process does not damage the fiber optic end-face.
5. How do I use the QbE Cleaning System?
Each individually packaged QbE Cleaning System contains detailed directions for four different cleaning operations. The user draws a clean QbE wipe over the cleaning platen, then follows the appropriate cleaning directions.
For “Dry” End-Face Cleaning:
■ Pull one QbE wipe over the fiber-safe neoprene platen.
■ Hold the end-face at 90 degrees, perpendicular to the platen.
■ Draw the end-face lightly over the platen in a smooth linear motion.
■ Do not press the end-face against the platen too hard.
■ Do not draw or retrace the end-face across the same area of the wipe.
■ Do not use a figure–eight motion; do not use a twist and turn motion.
■ Check your work with a fiberscope or other measuring device.
For “Wet” End-Face Cleaning:
■ Lightly spot the QbE™ wipe on the platen with Electro-Wash® PX Fiber Optic Cleaner (ES810).
■ Draw the end-face from the solvent wetted area across the dry area, using a smooth linear motion.
■ Check your work with a fiberscope or other measuring device.
For Splice Preparation:
■ Lightly moisten the QbE wipe with Electro-Wash PX Fiber Optic Cleaner and gently wipe away fiber contaminants.
■ Lightly dampen a 38540ESD swab and remove soils from the V-grooves on the fusion splicer.
For Buffer Gel Removal
■ Pull three single QbE wipes from the container.
■ Spray a small amount of Electro-Wash PX Fiber Optic Cleaner into the folded wipes.
■ Pull the cable through the first wipe and discard the wipe.
■ Repeat until the cable “squeaks” clean.
6. What makes the QbE Cleaning System unique?
The QbE Cleaning System container has double-walled, reinforced sides for extra durability, while the roll of lint-free wipes is wound around a center core that adds extra stability to the container as the roll is unwound. The large surface area of each individual QbE wipe provides enough space to clean two or even three fiber end-faces, so you can clean up to 600 end-faces with
one QbE Cleaning System. Since the cleaning platen comes new with each QbE Cleaning System purchased, there’s no chance the
platen will dry out and become hard before the unit is exhausted. This means less chance of damaging the end-face by rubbing it
across a dried-out, hardened rubber surface. The unique design of the QbE Cleaning System is currently patent pending.
7. Can cleaning solvents be used with the QbE Cleaning System?
The QbE Cleaning System is specifically designed to allow the use of solvent for a wet cleaning process, with an automatic drying
step, by drawing the end-face across the wipe from the solvent-wetted region to the dry part of the wipe. One can of Electro-Wash
PX Fiber Optic Cleaner (ES810) will deliver between 200 and 400 “shots” of cleaner, to match the 200 to 400 uses available from
each QbE wipe. Presaturated Electro-Wash MX wipes are also a good source of cleaning solvent for outside plant and in-field
service applications. Remember, it only takes a small amount of either solvent product to clean the fiber optic end-face or the
ferrule material.
8. What are the differences between reel cleaners and the QbE Cleaning System?
There are many differences between the QbE Cleaning System and other cleaning systems presently being used in the industry.
Some of the most obvious ones are:
■ Reel cleaners limit the user to a very small cleaning surface, usually only 0.75” x 1.0”, so they recommend “giving the end-face a quarter turn, then drawing it along the cleaner surface”. If there is hard grit on the end-face the “quarter turn” motion could result in scratching the end-face. The QbE Cleaning System uses a straight line cleaning motion which greatly reduces the
chance of damaging the end-face. Further, since the QbE Cleaning System is designed for use with solvent in a “wet” cleaning
process, the end-face is lubricated and less likely to be scratched. Three passes of the end-face across the QbE wipe and the
end-face is completely clean, with far less possibility of damage or scratching.
■ The conventional solvent used for cleaning end-faces is isopropyl alcohol (IPA), normally dispensed from squeeze-type
dispensers. IPA is very hydroscopic, absorbing moisture from the air very readily. The absorbed moisture dilutes the cleaner and
is then deposited on the end-face, which must then be dried. Electro-Wash PX Fiber Optic Cleaner is an aerosol package, so
there’s no way for it to be contaminated with atmospheric moisture.
■ Some reel cleaner systems advise using a “figure eight motion” when passing the end-face across the narrow cleaning window.
This motion is fine for polishing end-face surfaces, but when cleaning this motion produces drag, which can lead to linting of the cleaning surface. The larger QbE™ wipe area makes such a cleaning motion unnecessary, so there’s no chance of generating lint
when cleaning with the QbE wipe.
■ Each QbE Cleaning System carries detailed instructions for performing the four most common cleaning procedures used in the
industry. Other cleaning systems usually have separate instruction sheets, and sometimes no instructions at all.
CircuitWorks “The Mighty Pen”
Wednesday, August 19th, 2015Frequently Asked Questions
The Mighty Pen™
1) What exactly is The Mighty Pen?
The Mighty Pen is a brand new portable cleaning tool developed, patented and marketed by ITW Chemtronics®. It is designed to easily and quickly remove all types of residue, including permanent marker, adhesives, and ink stains – all in the portability of a pen.
2) What applications does the product work with?
■ Removes adhesives, tape and label residues
■ Cleans away ink marks
■ Eliminates flux residues
■ Removes conformal coatings
■ Refurbishes telephone equipment
■ Removes adhesive residue from medical devices
■ Cleans computer and rack systems
■ Spot cleans money changing equipment
■ All repair and maintenance spot cleaning
3) Where can The Mighty Pen be used?
The Mighty Pen can be used in rework and repair applications, and in field maintenance and service. It can be used to remove adhesive residue from phone systems, remove adhesive and ink marks from mirrors and glass, remove tracking stickers from medical devices, clean away adhesive and ink residue from integrated circuits, clean stray marks on phones and money changing machines, remove tape residues from computer housings…The Mighty Pen can be used where there is a need to eradicate adhesive residues, ink marks and other difficult to remove soils.
4) What type of companies would use this product?
All companies that are involved in field service and maintenance, repair, and refurbishment would have a need for this product. Also, anybody that cannot use Menda dispensers due to spilling/portability, gallon or pint liquids due to size and safety, or anybody that cannot use alcohol due to cleaning strength.
5) How is the pen packaged?
The pen is offered with 11.5 gm of solvent/pen, on a blister card. The label is our multilingual/thirteen language CircuitWorks® label. There are 12 pens/case.
6) What are the key features and benefits of the product?
Features
■ Extra cleaning power
■ Extremely portable
■ Pen dispensing system
■ Mild citrus scent
■ Patented (US patent #6677291)
■ Cap saver barrel
Benefits
■ Quickly removes a wide range of soils
■ Can easily be carried anywhere
■ Convenient and easy to use
■ Will not overpower the end-user
■ A truly unique formulation
■ Cap loss is prevented
7) Is the product plastic safe?
This material is safe on most plastics; however it is definitely not safe for use on acrylic, styrene, and carbonate based plastics. For a more detailed list of plastic compatibility refer to the Material Compatibility Chart on the Technical Data Sheet. To be on the safe side, always test on an inconspicuous area first.
8) How do I use The Mighty Pen to remove stickers?
The Mighty Pen will not degrade most plastic coatings on pressure sensitive stickers. Once the plastic coating is peeled off, the pen is designed to remove the adhesive residue that is left behind. However, if the solvent is applied on the edge and over the surface of the sticker, the solvent system will work it’s way under the label and make it easier to peel off the plastic coating.
9) Will this product remove “Sharpie” marks/permanent marker?
This is an ideal application for The Mighty Pen. Often people are convinced that nothing will remove “that permanent marker”! And when other products are used to remove permanent marks, often the ink is incompletely removed leaving behind an image “ghost”. The Mighty Pen’s unique formula and chisel tip scrubs away ghost images quickly. Permanent markers of all types can be quickly removed from surfaces such as glass, metal, and ceramics. Always test on an inconspicuous surface before use for material incompatibility, such as plastics, antiglare coatings on glass, etc. Plastic surfaces and painted surfaces must be tested on an inconspicuous area prior to use.
10) Is it safe for use on wood furniture?
In many instances there should not be any problems. However, The Mighty Pen can remove the varnish that protects the wood,leaving the surface dull or matte. To be sure test on an inconspicuous surface before use. The same is true for fabrics; test for colorfastness before use.
11) Will it remove coffee stains?
Yes. Again, the primary question is what is the substrate you are cleaning. Substrates such as keyboards (made from ABS or polycarbonate usually) and painted surfaces may be a problem, and should be tested prior to use. Test on an inconspicuous surface before use.
12) What about conformal coatings?
The Mighty Pen will do an excellent job removing silicone, acrylic, and urethane conformal coatings. The best way to remove the coating is to uncap the pen, press the nib onto the surface to be cleaned until solvent flows from the pen, and rub the coating away. It is recommended to remove any excess coating buildup from the surface with a wipe. It is also recommended to press the nib onto a wipe several times to flush the nib clean.
13) Can The Mighty Pen remove tar?
The Mighty Pen can remove tar, and other difficult to remove soils. Always check on an inconspicuous area to test the material substrate compatibility — especially on painted items.
14) Is the product safe for use on rugs? What about fabrics?
The Mighty Pen can remove oil, lipstick, and other difficult to remove soils. Again, always check on an inconspicuous area to test the material compatibility. For rugs and fabrics it is best to depress the pen tip onto the stain and let the solvent flow over the soil. Gently rub the nib into the soil to break up the soil, and blot with a clean wipe. The wipe will pull the soils into it. Repeat until the soil is removed.
15) What happens if I get it on my hands?
The Mighty Pen is a strong cleaner, and as such will dry out the skin. We recommend to always check the MSDS before using any chemical, and to always wear the appropriate protective equipment.
16) The Mighty Pen is listed as flammable. Why?
The Mighty Pen has a flash point below 100 degrees, and is therefore listed as flammable. This is in the same range as isopropyl alcohol (rubbing alcohol) and ethanol (Bacardi Rum151). However, the main solvent in The Mighty Pen is a terpene product (d-limonene, an ultra-purified version of orange oil) that is safely used throughout the world as a cleaning product.