Low Temperature Alloy Solders

August 21st, 2015

Low temperature alloys, which typically contain indium or bismuth, melt at temperatures less than 180°C. These low-melting alloys are required for a wide variety of applications, including:

  1. Step soldering involving temperature sensitive components
  2. Soldering to molded interconnect device (MID) plastics
  3. Fusible alloys/fuse applications
  4. Mercury replacement
  5. Thermal and electrical conductivity

Step Soldering Involving Temperature Sensitive Components

Step soldering is the process of attaching components to a substrate in a series of steps where each step in the soldering process uses a lower reflow temperature than the step before it. Standard components are attached first and then temperature sensitive components (like LEDs) are done last. These temperature sensitive components reflow at temperatures less than 180°C.

Soldering To MID Plastics

Molded interconnect device (MID) plastics have been around for many years, but are becoming more popular in product design. MID plastics, which are formed into 3D shapes to increase the functionality and reduce overall weight of each product, are important in automotive and medical applications.

Fusible Alloys/Fuse Applications

Fusible alloys are valued for their relatively low-temperature melting point precision, as well as for their physical properties at room temperature.

Fusible alloys can be used for:

  • Fuses
  • Tube bending
  • Lens blocking
  • Wax pattern dies
  • Potting molds
  • Punch anchoring

Properties

Property Indalloy
117 158 160-190 217-440 255 281
Melting Point or Range Deg/F 117 158 160-190 217-440 255 281
Weight lbs/in3 .32 .339 .341 .343 .380 .315
Tensile Strength lbs/in2 5,400 5,990 5,400 13,000 6,400 8,000
Brinell Hardness No. 12 9.2 9 .19 10.2 22
Maximum Load
30 sec lbs/in2
10,000 9,000 16,000 8,000 15,000
Safe Load Sustained 300 300 300 300 500
Conductivity (Electrical) Compared with Pure Copper 3.34% 4.17% 4.27% 2.57% 1.75% 5.00%
Cumulative Growth and Shrinkage Time after Casting
2 min. +.0005 +.0025 -.0004 +.0008 -.0008 +.0007
6 min. +.0002 +.0027 -.0007 +.0014 -.0011 +.0007
30 min. .0000 +.0045 -.0009 +.0047 -.0010 +.0006
1 hr. -.0001 +.0051 .0000 +.0048 -.0008 +.0006
2 hr. -.0002 +.0051 +.0016 +.0048 -.0004 +.0006
5 hr. -.0002 +.0051 +.0018 +.0049 .0000 +.0005
500 hr. -.0002 +.0057 +.0025 +.0061 +.0022 +.0005

Mercury Replacement

Indium Corporation manufactures several alloys that have very low-melting points. These liquid-at-room-temperature alloys are finding increased uses in various applications as a replacement for the more toxic mercury. In addition, the vapor pressures of these alloys are substantially lower than mercury.

Thermal and Electrical Conductivity

Alloy systems that are liquid at room temperature have a high degree of thermal conductivity, far superior than ordinary non-metallic liquids. This allows for the use of these materials in specific heat-conducting applications, such as the heat dissipation of sensitive components during operation, machining, and/or manufacturing.

Other advantages of these liquid alloy systems are their inherent high densities and electrical conductivities. Typical applications for these materials include thermostats, switches, barometers, heat transfer systems, and thermal cooling and heating designs.

The table below lists available Indalloy® alloys which are liquid at room temperature.

Indalloy
Number
Liquidus C Solidus C Composition Density
lb/in3
Specific
Gravity
gm/cm3
Thermal
Conductivity
(W/mK)
Electrical
Resistivity
(10-8Ω-m)
46L 7.6 6.5 61.0Ga / 25.0In / 13.0Sn / 1.0Zn 0.2348 6.50 15* 33*
51E 10.7 10.7 66.5Ga / 20.5In / 13.0Sn 0.2348 6.50 16.51 28.91
51 16.3 10.7 62.5Ga / 21.5In / 16.0Sn 0.2348 6.50 16.51 28.91
60 15.7 15.7 75.5Ga / 24.5In 0.2294 6.35 20* 29.42
77 25.0 15.7 95Ga/5In 0.2220 6.15 25* 20*
14 29.78 29.78 100Ga 0.2131 5.904 28.13 14.854
* Estimated

References:

1 Geratherm Medical AG, Safety Data Sheet, 93/112/EC, 20042 Michael D. Dickey, et al., Eutectic Gallium-Indium (EGaIn): A Liquid Metal Alloy for the Formation of Stable Structures in Microchannels at Room Temperature, Advanced Functional Materials, 2008, 18, 1097–11043 C.Y.Ho, et al., Thermal Conductivity of the Elements, Journal of Physical Chemical Reference Data, Vol. 1. No 2, 1972.4 Charles Kittle, Introduction to Solid State Physics, 7th Ed., Wiley and Sons, 1996. 

Packaging for Liquid Metal Alloys 

Liquid metal alloys are shipped in polyethylene bottles.

Storage/Shelf Life for Liquid Metal Alloys

Unopened bottles have a guaranteed shelf life of one year. It is recommended that the volume be replaced with dry argon as the material is removed from the bottle. This will minimize any possibility of oxidation on the surface of the alloy. If the alloy has been stored below its melting point and has solidified, it should be remelted and thoroughly shaken or mixed before use.

indium-bismuth_low_melting_temp-solder_252bismuth low-temperature melt solder

 

Source: Carol Gowan, Indium Solder Co.

 

5 Solder Families and How They Work

August 21st, 2015

Source: Indium Solder Co.

Solder is critical material that physically holds electronic assemblies together while allowing the various components to expand and contract, to dissipate heat and to transmit electrical signals. Without solder, it would be impossible to produce the countless electronic devices that define the 21st century.

Solder is available in numerous shapes and alloys. Each has its particular properties, providing a solder for nearly every application. Many times, solder is an afterthought in the design and engineering process. However, by considering the soldering step early in the design process, problems can be minimized. In fact, with the proper information, the characteristics of a solder can be part of an optimal design.

Solders for assembly of electronic devices melt at temperatures below 350ºC (660 F), and typically bond two or more metallic surfaces. The elements commonly alloyed in solders include tin (Sn), lead (Pb), antimony (Sb), bismuth (Bi), indium (In), gold (Au), silver (Ag), zinc (Zn), and copper (Cu).

Another material commonly used in soldering is flux. The primary function of flux is to remove existing oxides on the solder itself and on the metallic surfaces being bonded, and to protect these metals from further oxidation while at the high tem-peratures of the soldering operation. Fluxes typi-cally contain rosin and/or resin, and organic acids and/or halides, which are combined to produce the appropriate fluxing strength for a particular metallization..

Electronic solders can be grouped into the fol-lowing five families: tin/lead, lead-free, indium/ lead, low-temperature, and high-temperature. This article discusses these five alloy families, and several members of each family. It also describes the wide variety of solder forms.

Tin/lead solder alloys

Tin/lead alloys are the fundamental solders, with a history dating back to the early days of radio. This alloy family consists of three basic compositions that have melting points in the 180 C (355 F) region:

• 63Sn/37Pb: the eutectic composition with a melting point of 183 C (361 F). The term “eutectic”

indicates that the composition produces an alloy with a distinct melting point, versus a melting range.

• 60Sn/40Pb: a variation from the eutectic, with a melting range of 183 to 188 C (361 to 370 F)

• 62Sn/36Pb/2Ag: a composition that is often chosen for silver metallizations, with a melting point of 179 C (354 F).

These alloys have reasonable melting points, ad-equate wettability and strength, and low cost. Therefore, they account for perhaps 80 to 90% of all solders in electronics assembly. The perform-ance of these alloys is so well understood and doc-umented that the electronics assembly industry has designed and engineered products based on their properties.

Increasing the lead content and reducing the tin content results in solders with substantially higher melting points. Common versions are:

• 90Pb/10Sn: has a melting range of 275 to 302 C (527 to 575 F).

• 95Pb/5Sn: has a melting range of 308 to 312 C (586 to 593 F).

 

indium-solder-preforms_275 Solder preforms are available in a wide range of shapes and sizes, primarily for surface mount technology.

 

These alloys solder the terminations within elec-tronic components. High melting-point solders prevent the solder joint within the component from re-melting when the component is subsequently sol-dered to the printed circuit board (PCB), a step that typically involves the lower melting-point 63Sn/37Pb solder. High lead-containing solders, in general, have better fatigue performance, higher tensile strengths, and slightly reduced wettability when compared to the lower melting-point tin-lead compositions. Reducing-gas atmospheres, such as forming gas or pure hydrogen, are effective fluxing agents at these high soldering temperatures, and often substitute for chemical fluxes that may char at high soldering temperatures.

In spite of all the beneficial attributes and familiarity associated with these alloys, the presence of lead, and its potential environmental impact when products are discarded to landfills, has caused the industry to seek lead-free alternatives.

Lead-free solder alloys

Legislation in Europe will ban lead-containing solders, with a few exceptions, effective 01 July 2006. As a result, manufacturers, regardless of location, will have to comply if they plan to sell electronic products into Europe after the deadline.

Lead-free alloy development (for replacing Sn/Pb alloys) has largely focused on a group of al-loys that have become known by the acronym “SAC” for its Sn/Ag/Cu (tin-silver-copper) com-position. SAC alloys have compositions that range from 3.0% to 4.0% silver, and from 0.5% to 0.8% copper, with the balance tin. They are generally regarded as eutectic, or nearly eutectic, at ~217ºC (422 F).

It has been suggested that the properties of tin-bismuth-silver alloys are better than those of the SAC alloys, because they exhibit improved wetta-bility and fatigue resistance. However, tin-bismuth-silver solders do have some drawbacks. When combined with a lead-containing solder metallization, on the PCB or the component terminations, a small amount of tin-lead-bismuth eutectic alloy will form. This resultant alloy has a melting temperature of only 96ºC (204 F)! Because many temperature-cycling regimens do cycle up to 125ºC (257ºF), this presents an obvious problem. As a result, tin-bismuth-silver has been abandoned until the electronics industry is certain that all lead has been “purged” from electronics manufacturing. This is expected to take at least five or ten years.

Lead-free alloys, with all of their “environmentally friendly” hype, come with a few “issues” of their own:

•Higher melting temperature: The ~35ºC (63 F) higher melting temperature (vs. eutectic tin-lead) has to be considered in component and assembly design. Standard solder processing temperatures of 240 to 260ºC (464 to 500 F), associated with SAC alloys, can damage “standard” electronic compo-nents that are rated up to only 235ºC (455 F) be-cause they were designed for eutectic tin-lead. This higher processing temperature also results in higher manufacturing cost due to the extra energy needed to operate equipment at these higher temperatures.

• Greater fuel consumption: More energy means higher fuel consumption, which in turn means more pollution. Thus, the environmental benefit of lead-free alloys is somewhat mitigated.

 

indium-ball-grid-array-bg_192 These are solder balls on a ball grid array (bga)

 

 

• Multiple soldering steps: The other main issue revolves around the high-lead alloys (>85% Pb) that are often needed in assemblies requiring multiple soldering steps. These high-lead compositions melt in the 245 to 327ºC (473 to 620 F) range. To date, the only lead-free alloy that can exist at these higher temperatures is 80Au/20Sn (eutectic at 280ºC, 536 F). The gold cost associated with this alloy, and the fact that no lower-cost alternative lead-free compositions exist, has forced the industry to recon-sider a total ban on lead. As a result, the European lead-free legislation exempts lead-bearing alloys that contain 85% or more lead. Certain defense, telecommunications, and space applications are also exempt from lead restrictions.

Other lower melting-point lead-free alloys that are of some interest include 58Bi/42Sn (138ºC, 281ºF); Bi/Sn/Ag (~140ºC,~284ºF); and In/Sn (118ºC, 244ºF). They offer alternatives for appli-cations with temperature-sensitive components and materials. They also serve well in step-sol-dering applications in which the first level of as-sembly may have been constructed with a SAC alloy.

Low-temperature alloys

When added to various solder alloys, both in-dium and bismuth reduce the melting point. Ad-ditionally, high indium-containing, low melting-point solders have good ductility that often can compensate for mismatches in the coefficient of thermal expansion (CTE) between component and board materials.

Low temperature solders are useful in the sol-dering of temperature-sensitive components or sub-strates, as well as in step soldering. Step soldering is the process in which an initial soldering step is made with a relatively high-melting point alloy, followed by a soldering step with a lower-melting point alloy that can be applied without re-melting the previously soldered joints.

Examples of low-melting point solders are:

•52In/48Sn: a eutectic alloy with a melting point of 118 C (244 F).

• 58Bi/42Sn: a eutectic alloy with a melting point of 138 C (281 F).

• 80In/15Pb/5Ag: melting range of 142 to 149 C (287 to 300 F).

High-temperature solder alloys

In addition to the 90Pb/10Sn and 95Pb/5Sn sol-ders discussed earlier, other high-temperature sol-ders have melting points in the 300 C range. For example, 80Au/20Sn is a eutectic composition having a melting point of 280 C (536 F). This high tensile-strength, precious metal solder is often se-lected for the “gold to gold” sealing of large pack-ages. When processed in an inert gas environment such as nitrogen, this solder has the advantage of requiring no flux when soldering to two gold metallizations.

The alloy 92.5Pb/5.0In/2.5Ag has a melting range of 300 to 310 C (572 to 590 F). This solder has excellent thermal fatigue properties and is fre-quently chosen for applications in which the elec-tronic assembly is subjected to large thermal ex-cursions.

Indium-lead for thick gold metallizations

Anyone who spends time perusing the various solder compositions will quickly realize that tin is one of the main constituents in most solders. How-ever, tin has an affinity for alloying with precious metals such as gold. Studies indicate that 63Sn/37Pb at 200ºC (392 F) will dissolve one mi-cron (~40 micro-inches) of gold/second/unit area. As tin reacts with gold, a brittle Au/Sn intermetallic forms. When the concentration is high enough, these intermetallics have a deleterious effect on the thermal fatigue characteristics of the joint, and make it susceptible to fracture during thermal cycling.

For tin-bearing solders in applications with gold-plated materials, it is advisable to keep the gold layer thin, < 0.38 (15 micro-inches), thereby reducing the concentration of Au/Sn intermetallic that can form. However, many applications such as optoelectronics packages and defense/space electronics call for thicker gold metallizations. In such scenarios, in which the need for reliability is high, tin-bearing solders are not appropriate.

Unlike tin, indium has a much lower affinity for precious metals and dissolves gold at a rate 13 to 14 times slower than tin. Also, in devices with operational temperatures below 125ºC (257 F), the intermetallic that forms between indium and gold is of a much more compliant and ductile nature, and is not susceptible to embrittlement.

Therefore, the family of In/Pb solders is beneficial when soldering against thick gold film metallizations. The In/Pb alloys are a solid solution system in which the liquidus and solidus temperatures are close for all compositions (near-eutectic at all compositions). The indium-lead system offers alloys of varying melting points, with indium-rich compositions having a lower melting range, and the lead-rich compositions having a higher melting range. For examples: 70In/30Pb has a melting range of 165 to 175 C (329 to 347 F), and 81Pb/19In has a melting range of 260 to 275 C (500 to 527 F).

Solder is typically provided in these common forms:

• Bar/Ingot: Typically cast and used in solder pot or wave sol-dering applications.

• Shot: Small tear-drop shaped pieces of alloy. The relatively small size offers flexibility in applications in which the alloy has to be weighed to a particular amount, such as filling crucibles for vapor deposition.

• Spheres: Also called precision solder balls, spheres are supplied with diameters from 0.012 to 0.032 in. They are deposited as bumps on elec-tronic packages such as BGAs (ball grid arrays).

• Ribbon and foil: Typically thin (0.002 to 0.010 in.+ thick) pieces of solder, foil often has a square or rectangular geometry. Ribbon, on the other hand, is more of a long, narrow strip wrapped on a spool. Both can be hand cut to form simple preforms or to make shims and thermal interfaces.

• Wire: Often applied in rework or cut to lengths and formed into rings or other simple shapes, wire diameters typically range from 0.010 to 0.030 in. However, smaller and larger diameters are available, de-pending on the alloy. Solder wire can be produced with a flux core.

• Preforms: Typically punched, these thin pieces of solder are manu-factured as squares, rectangles, frames, disks, washers, and custom geome-tries. Solder preforms can be applied in surface mount technology (SMT), which is common to the manufacture of most consumer electronics such as cellular phones and computers. Preforms separately attach a component to a pad, or they augment the solder volume of the solder paste. Washers serve as pin connectors or other through-hole components.

• Paste: A mixture of prealloyed spherical solder powder with a flux/vehicle to form a pasty material. Paste is dispensed or stencil-printed onto the metallization pads of a printed circuit board, and components are automatically placed onto the solder paste. The tacky nature of the solder paste temporarily holds the components in place. The printed circuit board is then reflow soldered, attaching the components to the pads. Solder pastes are available with RMA, no-clean, and water-soluble flux vehicle formulations.

 

Selected lead-free solder alloys

1E   52In/48Sn (118°C) (Eutectic) — Lowest melting-point practical solder.

281   58Bi/42Sn (138°C) (Eutectic) — Good thermal fatigue performance;

established history.

227   77.2Sn/20.0In/2.8Ag (175°C) 187 — Not for use over 100 C due to Sn/In eutectic at 118° C.

254 86.9Sn/10.0In/3.1Ag (204°C) 205  No Sn/In eutectic problem; potential use for flip chip assembly.

241 95.5Sn/3.8Ag/0.7Cu (217-218°C) (Eutectic) — Common lead-free alloys.

246 95.5Sn/4.0 Ag/0.5Cu (217-218°C) (Eutectic) — Petzow (German) prior art reference makes this alloy patent-free.

2521 95.5Sn/3.9Ag/0.6Cu 217-218°C)  (Eutectic) — NEMI promoted alloy (average composition of Indalloy #241 and #246).

249 91.8Sn/3.4Ag/4.8Bi (211°C) 213 –board and component metallizations must be lead-free.

121 96.5Sn/3.5Ag (221°C) (Eutectic) — Binary solder has history of use, marginal wetting.

244 99.3Sn/0.7Cu (227°C) (Eutectic) — Inexpensive, possible use in wave soldering.

133  95Sn/5Sb (235°C)  240 — —

209 65Sn/25Ag/10Sb (233°C)  (Melting point) — Die attach solder, very brittle.

Note: Alloy of choice for general SMT assembly; 2. ICA patent; 3. ICA licensed Sandia patent.

 

 

Source: Eric Bastow is a Technical Support Engineer at Indium Corp. of America, Web site: www. indium.com.

 

 

 

 

 

 

 

 

 

 

 

 

Indium PoP Flux vs. PoP Paste: Which one is best?

August 21st, 2015

Indium PoP Flux vs. PoP Paste: Which one is best?

 

Category:

 

 

I have recieved a number of inquiries over the years regarding the Pack-on-Package (PoP) Manufacturing Processes. One of the most frequent questions that I have recieved is whether to use a PoP flux or a PoP solder paste.

Most people use a PoP flux because it is a much easier process to set-up and maintain. However, there are advantages to using PoP solder paste as well. When using components that exhibit high warpage levels, PoP solder paste will allow you to bridge the gap between the top and the bottom component while the warpage is occuring.  Flux may be able to bridge the gap; however, there is no powder alloy present to create an alloy gap filler if the solder bump on the top package reaches the solidus point before the component warps back to the original level and makes contact with the bottom package.  his would result in a “Snowman” Defect because there is not alloy present to bridge the gap. The Snowman Defect is another warpage-induced defect similar to Head-in-Pillow (HiP) or Non-Wet-Open (NWO), but there is no paste printed on the bottom substrate.

The PoP solder paste dipping process takes far more time and effort to set-up and maintain. For example, with paste, you have to make sure the dipping dwell time and dip depth is optimized perfectly for the component that you are dipping. If too much PoP solder paste is applied to the bottom of the component (component bumps), bridging can occur even before the component is placed on the bottom package. If too little PoP solder paste is present, there may not be enough flux there to create a proper solder joint.

The PoP Flux process is far more forgiving and presents a wider process window, as long as component warpage isn’t a concern.

I will talk more about the PoP dipping process set-up, optimization, and maintenance in future blog posts.

– See more at: http://www.indium.com/blog/pop-flux-vs-pop-paste.php#sthash.5Hqcxv4e.dpuf

Source: Indium Corporation, 2015

Glossary of Terms : Electronics Manufacturing, Rework & Repair

August 20th, 2015

Glossary of Terms for the Electronics Industry
Aerosol – A suspension of very small particles approximately 100 microns or smaller in size in a gas, for example: fog, smoke,
and fine sprays.
Aerosol Generators – Mechanical means of producing a system of dispersed phase and dispersing medium. Used to
generate aerosols such as DOP for HEPA filter leak testing.
Aerosol Photometers – Light-scattering mass concentration indicating instruments have a threshold sensitivity of at least
10-3 microgram per liter for 0.3 micron diameter DOP concentrations over a range of 105 times the threshold sensitivity.
Photometers may include hand-held remote meter probes which can scan for airborne contaminants in HEPA filters, in penetrations
around frames, seals, and plenums, and in hoods and workstations. (IES)
Air Change Rate – The number of times the total air volume of a defined space is replaced in a given unit of time. This is
computed by dividing the total volume of the subject space (in cubic feet) into the total volume of air exhausted from the space per
unit of time. (NEBB)
Air Cleaners – Filtration systems that may be free standing or installed in a ceiling or wall; remove contaminants such as
bacteria, viruses and dust from the air. Air cleaners may incorporate HEPA filters.
Air Dyers – Units that provide dry, pressurized air for drying wafers, instruments and other parts.
Air Showers – Chambers located between the cleanroom and an outside environment that remove particulate contamination
from cleanroom garments as personnel pass through. The chambers may include HEPA filters, interlocking doors, a re-circulating
air system, and air nozzles in various patterns through which filtered air is blown onto the personnel in the shower. The air is
moved over the worker, removing particulate contamination from the worker’s garments.
Air Velocity Meters/ Monitors – Meters measure and indicate the force and speed of airflow. Meters may use a variety
of probes for measuring near HEPA filters and in right angles. Monitors check and regulate air velocity.
Airborne Particulate Cleanliness Classes – The statistically allowable number of particles per cubic foot of air
according to Federal Standard 209E.
Alarms – Visual and audible alarms are used to warn of unacceptable conditions at monitored sites. Alarms may use buzzers,
bells and/or warning lights.
Ambient – The normal environment conditions such as temperature, relative humidity or room pressure of a particular area
under consideration.
Anemometer – A device that measures air speed.
Antistatic – Reducing static electric charges by retaining enough moisture to provide electrical conduction. Has a surface
resistivity of 109 to 1012 ohms per square.
Antistatic Cleaners – Liquid cleaners that enhance surface resistivity of cleanroom tabletops, workstation, and other surfaces.
Architectural Design/Construction Services – Contract services provide for the design and construction
of cleanrooms. Included are architecture, engineering, construction management, planning and turnkey construction of
cleanroom facilities.
As-Built Cleanroom – A cleanroom facility that is complete and ready for operation with all services connected and
functional, but without production equipment personnel within the facility.
At-Rest Cleanroom – A cleanroom facility that is complete and has the production equipment installed and operating, but
without personnel within the facility.
ATR – Attenuated total reflectance.

Bags – Containers for storing parts, products, etc. Antistatic static shielding and breather bags are common types of bags used in
cleanrooms. Antistatic and static shielding bags are used to encase static sensitive devices of most sizes. Breather bags are used for
parts sterilization and can be autoclave, EtO, dry heat or radiation sterilized. The bags typically are cleaned in cleanroom conditions.
Barometers – Instruments used to measure atmospheric pressure.
Barrier Pressure Packs – Seamless aluminum cans house a sprayed-in plastic pouch of PVC or polyolefin. The pouch
adheres to the upped part of the can to form a leak-proof seal. The product is dispensed by depressing the can valve. The can
allows separation of the product from the propellant.
Benches – Furniture which accommodates seating for several people. Used in gowning areas to divide dirty and clean areas.
Biological Safety Cabinets – Bench-top or freestanding cabinets with laminar airflow used for handling materials
that present a health hazard. Cabinets typically include a work surface; HEPA filters for supply and exhaust air, and a protective
view-screen.
Blower/Exhausters – Devices used to move and/or control air in HVAC systems, HEPA/ULPA filters modules or to circulate
air or exhaust air from workstations.
Blower/Filter Modules – Self-contained units house a HEPA or ULPA filter and a blower to distribute the air. The units,
which are mounted into a cleanroom ceiling, wall or bench, provide filtered airflow at various blower speeds.
Boots – Protective coverings for the foot that extend part way up the leg. Boots may be made of antistatic materials, and can be
disposable or laundered for reuse.
Bottles – Containers used primarily for liquids, made of plastics, Teflon or other cleanroom compatible material. Bottles can be
used to store chemicals and other liquids.
Boxes Antistatic/ Conductive – Containers used for transport and storage of parts and materials which are subject to
static damage. The cases/boxes are made of conductive materials and are available in a variety of sizes. Antistatic trays, inserts
and pans may be available with the cases.
Breath Control Shields – Typically made of acrylic or plastic materials, shields isolate equipment or the work from particulate
contamination expelled by workers.
Brushes – Cleanroom and static control brushes are made of double-cleaned, non-static-generating natural hairs or stainless
steel. They are used for cleanroom cleaning applications.

Caps, Bouffant – Full or puffed-out head coverings held in place with an elastic opening. The caps are made of cleanroom
compatible fabrics, most commonly, spun-bonded polypropylene.
Carts – Wheeled vehicles used to transport chemicals, supplies and other materials within or between cleanrooms. Chemical
carts may be enclosed, and include drain trays to contain spills within the cart.
Cathode Luminescence – Luminescence produced when high-velocity electrons bombard a metal in vacuum, thus
vaporizing small amounts of the metal in an excited state, which amounts emit radiation characteristic of the metal.
Ceiling Grid Systems – Frameworks of parallel and perpendicular bars used to house filters and light fixtures in cleanroom
ceilings. The grids may include a gel or other type of sealant for providing an airtight seal around the filters.
Certification – The process of validating the performance of environmental systems in order to show compliance to specifications.
Chairs – Cleanroom chairs are made with cleanroom compatible materials such as stainless steel or aluminum. They may
include filtered back and seat cushions to eliminate contamination expelled when a worker sits down. They may be made of
conductive materials to provide static protection.
Chemical Adsorbers – Dry processed carbon composite adsorbers for chemical adsorption systems.
Chemical Filter Systems – Solution purification systems that pump, filter, agitate and carbon-treat chemical processing
solutions.
Clean Zone – A defined space in which the concentration of airborne particles is controlled to specified limits. (Federal
Standard 209E)
Cleaners – Emulsify grease, oil and other soils on surfaces.
Cleaners, Parts – Various types of equipment for cleaning miscellaneous parts and quartzware. They equipment uses water
and/or chemical baths to clean parts. Chemical fumes are drawn out and exhausted from the unit.
Cleaning/Janitorial Services – Specialized maintenance and cleaning of cleanrooms, including vacuuming and other
cleaning services.
Cleaning Tools/Supplies – Cleaning tools include rollers, brooms and cleaning guns. Roller/applicators may have sponge
or adhesive rollers to clean work surfaces, floors or walls.
Cleanroom – A room in which the concentration of airborne particles is controlled to specified limits. (Federal Standard 209E)
Cleanroom Candy – For relieving dehydration due to low humidity in cleanrooms. The candy is packaged in antistatic
cleanroom bags, with each piece individually wrapped.
Cleanroom Clocks – Wall-mounted clocks have plastic cases, and are packaged for Class 100 environments.
Cleanroom Phones – Flush-mounted or wall-mounted units that function as standard telephones. Connections can be
made within the building or to outside lines.
Cleanroom, Mobile/Portable – Typically consist of a frame with curtains and ceilings filter modules. May be moved
without disassembling. The rooms may include lighting, pre-filters and casters for portability.
Cleanroom, Modular – Pre-fabricated rooms that are delivered equipped with all components and are ready for assembly.
They may be expandable, re-locatable and typically are available in variety of sizes.
Coatings – A coat or layer over a surface. High purity coatings using fluoropolymers, Teflons, epoxy and plasma deposition can
be applied to walls, racks, electric motors, containers and furniture. Static control coatings are topically applied and are used for
non-porous surfaces such as Teflon and plastic.
Communications Systems – Systems available include intercom units and speak-throughs. They systems allow
communication between personnel whom are within and outside the cleanroom. Computer communication systems provide access
to cleanroom computers remotely from outside the cleanroom.
Compressors – Machines used to increase the pressure of a vapor or gas. Oil-free compressors are used for applications
requiring ultra-pure air.
Condensation Nuclei – Small particles normally within the size range of 0.01 micron to 0.1 micron radius upon which
water vapor condenses in the atmosphere. (IES)
Conductive – Having that property of conductivity or transmitting electricity. Has a surface resistivity of less than 105 ohms
per square.
Containment Boxes – Provide isolation for valves, flow meters and other instruments. Boxes may be made of PVDF
or polypropylene.
Containment Rooms – Rooms provide a cleanroom environment while containing or isolating the process being performed
inside the room. Outside air may be taken into the rooms, where it is filtered through HEPA filters.
Contamination – The process or act by which materials or surfaces are soiled with bacteria or other contaminating substances.
Controlled Area – An air-conditioned workspace or room in which the particle concentration is lower than normal air
conditioned spaces. A controlled area is not to be classified as a cleanroom, but some special filtration is required. (NEBB)
Controller – An instrument that measures the value of a variable quantity or condition and corrects deviations from preset values.
Coveralls – One-piece, loose fitting outer garments with sleeves and legs which are worn over regular clothing to protect products
from contamination.
Curtains – Made of vinyl, conductive vinyl, heavy-duty vinyl or other materials with antistatic grids. Used for directing airflow,
separating processes and for static reduction of wet process hoods and other equipment.

Data Management Systems – Computerized systems integrate analog, digital and serial inputs from on-line devices
such as particle counters. The systems provide reports and graphic data trends.
DCP – Direct current plasma.
Decontamination Factor – The ratio of the concentration of a contaminant in the uncleaned (untreated) air to its
concentration in the clean (treated) air. (IES)
Dehumidifiers – Reduce the amount of water vapor in the ambient atmosphere.
Deionized (DI) Water – Water from which charged or ionizable organic and inorganic salts are removed.
Desiccators – Closed containers, usually made of glass or plastic, with and airtight seal, used for drying materials.
Diffusers – Spread out or diffuse gases and liquids.
Disinfectant Cleaners – Chemical agents that destroy microorganisms.
Dispensers – Used to hold cleanroom gloves and finger cots, or other products, and are made of stainless steel, plexiglass,
enamel or plastics.
Doors – The exit from or entrance to a cleanroom. Cleanroom doors often are equipped with windows and are interlocking; one
door remains closed while the other door is open.
DOP – Dioctyl phthalate; a viscous liquid used to test cleanroom air filters.
DOP Aerosol – A dispersion of dioctyl phthalate droplets in air.
Dryers, Hand/Glove – Used to dry hands/gloves, the units use HEPA filtered heated air.
Duct Cleaning System – Use HEPA filters, vacuum and disinfectant to clean HVAC ducts. Portable units can be transported
and include a variety of tools.
Ducts – Passages for the flow of air through a ventilation system.
Ducts, Exhaust – Exhaust gas and fumes from work benches and cleanroom areas. Fire-resistant ducts are used to exhaust
non-flammable, toxic and corrosive vapors. Ducts may be made of resins and other non-smoke-generating materials.
Dust Removers – Compressed gas in a can with extension tube. Used for cleaning equipment, parts, etc.

Environmental Control Systems – Computerized systems provide control and monitoring of temperature, humidity,
ventilation, lighting, pressure, airflow, electricity, motion, fire/life safety access control and other environmental conditions.
ESD (Electrostatic Discharge) – A transfer of electrostatic charge between object at different electrostatic potentials
caused by direct contact or induced by electrostatic field.
ESD Protective Material – Material capable of limiting the generation of static electricity; rapidly dissipating electrostatic
charges over its surface or volume; or providing shielding form ESD spark discharge or electrostatic fields. ESD protective materials are classified according to their surface resistivity as conductive, static dissipative, antistatic or insulative.

Fabric Membranes – Waterproof, breathable materials that prevent liquid from soaking into fabrics, while allowing moisture
to escape. The membranes can be laminated to various fabrics.
Face Masks – Coverings for part of the face (specifically the nose and mouth) that prevent contamination from exhaled matter.
Masks are made of a variety of cleanroom fabrics.
Face Velocity – The velocity obtained by dividing the air quantity by the component face area. (NEBB)
Facility Monitoring Systems – Integrated hardware and software systems that allow data to be acquired from multiple
outputs. The systems capture data from environmental monitoring points.
Fast Tracking – A building method in which construction begins before plans and designs are complete.
Federal Standard 209E – The document that establishes standard classes of air cleanliness for airborne particulate levels
in cleanrooms and clean zones. It prescribes methods for class verification and monitoring of air cleanliness. It also addresses
certain other factors, but only as they affect control of airborne particulate contamination.
Fibers – Particles with lengths of 100 microns of more and aspect ratios of at least 1:10; fibers are woven into fabric.
Filter Cartridge – Used to filter liquids. The cartridges are the part of the filter unit made of a particular media or material.
Common filter media include carbon, cellulose, ceramic, cloth, glass fiber, nylon, paper, polypropylene, polysulfone, polycarbonate,  porous metal, PTFE, stainless steel and wire cloth. The media is assembled in a number of configurations, including cell assembly,
cross flow, hollow fiber, pleated, spun bounded, string wound and tubular.
Filter Housing – Outside assemblies that house filter cartridges. Housings are available in a variety of materials including
carbon, steel, polypropylene, PTFE and stainless steel.
Filter Media – The portion of a filter cartridge or system that provides the separation of liquids and solids. Filter media
includes paper, cellulose, glass fiber, membranes, nylon, PTFE and 316 L stainless steel.
Filter Modules – Units that house a HEPA or a ULPA filter. The units are mounted into cleanroom ceilings, walls or benches
and provide filtered airflow.
Filter Testing Systems – Systems for testing liquid and air filters include robotic scanning that automatically tests HEPA
filters and reports the data. Liquid filters can be tested via computerized system that perform pressure hold and bubble point
integrity tests.
Filters, Gas – Remove solid and liquid aerosol contamination as well as water and oxygen from high purity gases such as
helium, nitrogen, hydrogen and other gases.
Finger Cots – Coverings or sheaths for the finger to be worn where complete hand covering is not required and tactile
sensitivity is desired. They are available in a variety of materials for cleanliness and ESD properties.
Fire Detection/Suppression Systems – Used for detecting/suppressing fires and detecting particles from thermal
degradation or combustion in cleanroom wet benches, workstations, fume hoods and other equipment as well as in cleanrooms.
Detectors may use technology and air sampling methods, which are not affected by airflow, humidity, vibration and other conditions
within the cleanroom. Suppression systems include those designed for wet benches that use carbon dioxide as the extinguishing agent.
Fittings – Connect sections of liquid and gas tubing to each other or to valves, filters, regulators or gauges in piping systems.
Fittings should be made of the same material as the tubing to which they are attached. They commonly are made of stainless
steel, plastic or PTFE.
Floor Coatings/Waxes – Cleanroom floor coatings and waxes may provide antistatic properties to reduce static build-up.
The coatings are sealants, which protect the floor from chemicals, solvents and bacterial growth. Waxes also may provide static
dissipation, and are applied like standard liquid floor waxes.
Flooring – Various types of flooring are used in cleanrooms, depending upon cleanliness levels. Contamination control flooring
may have a tacky finish, to trap dust and other debris from wheels and shoes. Access flooring consists of solid or perforated panels
or raised pedestals. Air can flow through perforated panels to maintain laminar flow and can be exhausted in a sub-floor area.
Vinyl flooring features sealed seams to prevent accumulation of contamination. Static dissipative flooring prevent static buildup and
electrostatic discharge.
Flow-meters – Instruments used to measure pressure, flow rate and discharge rate of a liquid or gas.
Flux Removers – Chlorinated solvents with alcohols formulated to remove soldering flux, that may be sprayed from aerosol
cans. The cans usually feature extension tubes to concentrate the spray in small areas.
FTIR – Fourier transform infrared spectroscopy.
Fume Hood Velocity Controls/Monitors – Electronic monitors used to measure fume hood face velocity, volume
flow or differential pressure.The monitors warn of unsatisfactory airflow rates.
Fume Hoods – Units that filter fumes from chemicals, solvents, acids and other hazardous materials. Hood includes HEPA filters
and/or carbon filters to filter fumes from the work surface and return purified air to the room. A glass, plexiglass or acrylic front panel
may be included.

Garment Fabrics – Material used to make garments is made from fibers or threads by weaving, knitting or other means.
Garment Processing Equipment – Garment washing, drying or dry cleaning equipment incorporating filtration systems.
Garment Processing Services – Services for the cleaning, rental, processing and sterilization of cleanroom garments.
Laundering and processing are done in cleanrooms using filtered water. Typically includes testing of garment cleanliness, rental of
cleanroom garments, and EtO and gamma irradiation sterilization.
Garment Racks – Freestanding racks made of cleanroom compatible materials such as stainless steel and polypropylene.
Garment Storage Bags – Made of cleanroom compatible fabric and used to transport garments (usually a coverall, boots
and gloves) from one clean environment to another, or to store garments. Bags may be static dissipative and/or chemical resistant.
Garments – Items of clothing worn to protect a cleanroom atmosphere from contaminants released by workers. Garments
include coveralls, frocks, lab coats and smocks.
Gas Detectors/Monitors – Instruments that identify and measure gases in an environment.
Gas System Design/Process Piping Installation – High purity systems, toxic gas systems, gas distribution and
management systems, and chemical and liquid distribution systems are designed and installed. Mechanical and piping contracting
services, as well as, quality control and testing may be provided.
Gases – Pure gases include argon, hydrogen, nitrogen, helium and others.
Glove Inflator – Allows easy donning of gloves. The gloves are inflated using air, allowing the user to put and take off the
gloves easily.
Glove Liner – Half-finger glove liners are worn under latex or vinyl gloves to absorb moisture away from the skin during
extended periods of glove wear. Glove liners are typically made from polyester or nylon.
Glove Sealers – Seal cleanroom gloves around the wrists of cleanroom garment sleeves.
Glove boxes – An enclosure, with or without gloves, that services the nuclear, biomedical, semiconductor, chemical and other
industries where confinement to or from the atmosphere is required using low differential pressure. (American Glove Box Society)
Typically, is a small enclosure where handwork is done in an environment isolated from the worker. The worker inserts his hands
only through built in gloves.
Gloves – Hand coverings having separate sections for each finger and the thumb. Gloves often extend part way up the arm.
Gloves are available in latex, vinyl, neoprene, nitrile, nylon, polyester, polyurethane, PTFE and other materials. They are available in
antistatic and conductive, chemical resistant, sterile, powdered and powder-less styles in a variety of lengths and sizes, and may
be ambidextrous or hand-specific.
Ground – A metallic connection with the earth to establish zero potential or voltage with respect to ground or earth.

Hand Cleaning System – An automated unit that dispenses a cleansing solution onto hands when placed into the
machine. The unit also may dry the hands with HEPA filtered air.
Hand Tools – Instruments used to handle critical products or perform certain tasks.
Helium Detectors – Use helium as the tracer gas to test for leaks in vacuum systems.
HEPA Filters – High Efficiency Particulate Air Filters are replaceable extended-media-dry-tape filters in a rigid frame having a
minimum particle-collective efficiency of 99.97% for 0.3 micron thermally generated dioctyl phthalate (DOP) (or specified alternative
aerosol) particles, and a maximum clean filter pressure drop of 2.54 cm (1”) water gauge when tested at rated airflow capacity. (IES)
Hoods – Head and face coverings that also cover the neck and may extend to cover the shoulders. Eyes-only hoods allow only the
eyes to be uncovered; other hoods are open-faced or cover part of the face. Helmet shield systems have HEPA filtered air packs.
Humidifiers – Units that add moisture to the air, for comfort and ESD control. ESD builds more in drier air.
HVAC System Design – Service includes the design of air conditioning, plumbing, process piping and temperature/humidity
systems. Systems may include HEPA filters, pre-filters and noise control devices.

Insulative – Material that is a poor conductor of electricity. Has a surface resistivity of greater than 1012 ohms per square.
Instrument Battery Packs – Rechargeable battery pack used to extend the battery life of monitors and other instruments.
Ionization – The process by which a neutral atom or molecule, such as air, acquires a positive or negative charge.
Ionization Equipment – Ionization equipment releases positive and negative ions to neutralize static. Ions are released from
emitter points on bars or grids or other apparatus into the air. Power modules are available to operate a number of ionization grids
or bars simultaneously.
Isokinetic Sampling – A technique for collecting airborne particulate matter in which the sampling device is designed so
that the air stream entering has the same velocity and direction as the ambient atmosphere being sampled.

Kohm – A unit electrical resistance equal to 1000 ohms.

Laminar Flow – Airflow in which essentially the entire body of air within a confined area moves with uniform velocity along
parallel flow lines. Usually this is from the ceiling fan filter units straight down to the floor.
Leak Detection Systems – Instruments and materials designed to detect leaks in closed systems.
Leak, HEPA Filter – A gap or void in filter media or gaskets, which permits unfiltered air to penetrate into the cleanroom or
clean workstation. (IES)
Light Curtain – Used to protect personnel from robots used in manufacturing processes. The system may include infrared
light guards that cast beams around the robots. If the beams are interrupted, the robot stops.
Lighting – Room lighting is supplied by ceiling mounted modules, often incorporated into ceiling HEPA filter modules. Work area
lighting may be supplied by illuminators – concentrated light sources that are placed next to the work area – which can be adjusted
to focus light on the desired area. Fixtures are sealed to prevent contamination, or aerodynamically designed so they do not interrupt
the laminar flow.

Manometers – Instruments for measuring; a U-tube partially filled with liquid, actually water, mercury or a light oil, so constructed
that the amount of displacement of the liquid indicated the pressure being exerted on the instrument. (NEBB)
Material Handling Equipment – Mechanical or automated equipment that moves materials or products.
Mats, Contamination Control – Used to trap contamination from cartwheels and shoes prior to entering the cleanroom
or air shower. Mats are available with tacky finish disposable sheets, which are peeled off and discarded when soiled. Adhesive
strips hold the mats to the floor. Mat frames are available to hold some types of mats in place.
Mats, Other – Mats made of cleanroom compatible material in various configurations for different applications and may be
designed to combat worker fatigue and static.
Meters – Instruments used to measure and record quantity or rate of flow.
Meters, Temperature/Airflow/Humidity – Meter measure air temperature, relative humidity and/or air velocity.
Instruments may use interchangeable probes to measure each condition.
Microbial Air Samplers – Used to collect and monitor airborne or surface microorganisms. The instruments typically use a
method by which organisms are drawn into an impeller drum, where they are impacted onto an agar strip by centrifugal force.
Microbial Tracking – Analysis, comparison and tracking of microbial strains.
Micron (micrometer) – An instrument through which minute objects are enlarged by a lens or lens system. Types include
optical, electron and x-ray.
Mini-Environment – These enclosures are commonly mounted to a ceiling and provide an isolated environment. They consist
of a HEPA filter/blower hung on the ceiling over an area with curtains, plastic or glass panels surrounding the filtered area. They
may also be free standing or on wheels for portability.
Mixed Airflow Cleanroom – A cleanroom with a combination of laminar or unidirectional airflow and turbulent airflow
within the same enclosure.
Mohm – A unit of mechanical mobility, equal to the reciprocal of one mechanical ohm.
Monitors – Devices used to check and/or regulate.
Mops – Available with sponge head, string heads, tubular knit polyester (no edges) or adhesive disposable poly foam laminate
sheets. Mops are used to remove contaminants from walls, ceiling, floors, windows and other surfaces.
Mop Wringers – Used with cleanroom sponge mops to eliminate manual wringing in critical areas.

Noise Control Materials – Acoustical foam and curtains block noise and are installed on floors and walls. Noise-dampening
tiles and pads also are available.
Non-unidirectional Airflow – (known as turbulent flow) Airflow which does not meet the definition of unidirectional airflow
by having either multiple pass circulating characteristics or a nonparallel flow direction. Turbulent flow cleanrooms exhibit
non-uniform or random airflow patterns throughout the enclosure. (Federal Standard 209E)

Ohm – The unit of electrical resistance in which a potential difference of one volt produces a current of one ampere.
Operational Cleanroom – A cleanroom facility in normal operation with all services functioning and with production equipment
personnel present and performing their normal work functions in the facility. (Federal Standard 209E)
Ovens – Heated enclosures for baking, heating or drying. Cleanroom ovens have HEPA filters.

Packaging – Packaging films and materials are used for cleanroom packaging of parts, garments and other materials.
Packaging materials include PVC, polyethylene and Teflon. Sterilizable packaging materials are available which allow the flow of
stream and ethylene oxide gas.
Particle – A solid or liquid object, generally between 0.001 micron and 1000 microns in size. (Federal Standard 209E)
Particle Concentration – The number of individual particles per unit volume of air.
Particle Counters – Instruments used for counting particles larger than a given threshold in air, gases and liquids (LPC).
Methods of counting include optical (OPC) and laser. Airborne particle counters count airborne particles larger than a given
threshold size.
Particle Size – The apparent maximum linear dimension of the particle in the plane of observation as observed with an optical
microscope or the equivalent diameter of a particle detected by automatic instrumentation. The equivalent diameter is the diameter
of a reference sphere having known properties and producing the same response in the sensing instrument as the particle being
measured. (Federal Standard 209E)
Particle Size Standards – Used to check the accuracy of equipment and instruments that measure and count sub-micron
particles. The standards are traceable standard uniform polystyrene spheres.
Particulate – A substance that consists of particles (minute quantities of solid or liquid matter).
Pass-Throughs or Pass-Thrus – Openings in walls with tow doors through which materials and objects are passed.
Pass-through doors interlock so that one door always is closed while the other is open.
Penetration – The exit concentration of a given gas from an air-cleaning device, expressed as percentage of inlet
concentration. (IES)
Piping, Fluids/Gases – Provides ultra-pure flow paths for gases and liquids to and from the cleanroom. The piping commonly
is made of stainless steel or a variety of very clean durable and inert plastics.
PIXE – Proton-induced x-ray emission.
Plastic Sheet Materials – Transparent, clear or colored PVC, acrylic or other plastic sheets used for static dust control in
cleanroom windows, curtains and partitions.
Plenum Chamber – Replaceable filters installed before a final filter to remove gross contaminants and protect the final filter
from environmental conditions. The per-filters have a lower efficiency than the one they protect.
Polymers/Plastics – Provide chemical and corrosion resistance, and maintain properties over a range of temperatures. They
can be used in the manufacture of cleanroom components and equipment.
Pre-filters – Replaceable filters installed before a final filter to remove gross contaminants and protect the final filter from
environmental conditions. The pre-filters have a lower efficiency than the one they protect.
Pressure, Static – The pressure of a fluid at rest, or in motion, exacted perpendicularly to the direction of the flow. (IES)
Pressure, Total – Pressure representing the sum of static pressure and velocity pressure at the point of measurement.
Pressure, Velocity – Pressure caused by and related to the velocity of the flow of fluid; a measure of the kinetic energy of
the fluid. (IES)
Pressure Gauges – Measure and indicate positive, negative or differential pressure.
Pressure Regulators – An open-close device used on the vent of a closed gas pressure system to maintain pressure in a
specified range.
Processing Equipment, Pharmaceutical – Specialized equipment used to produce and process pharmaceuticals.
Equipment used for filling, stoppering, tableting, mixing/agitating and other processes are available.
Processing Equipment, Semiconductor – Equipment used in various steps of producing semiconductor devices.
Product Decontamination – Contact sterilization, including cobalt-60 gamma radiation processing and ethylene oxide
(EtO) sterilization.
Psychrometric Chart – A graphical representation of the thermodynamic properties of moist air. (NEBB) It shows relative
and absolute humidity.
Pumps – Used to maintain a vacuum or to distribute fluids and gases. Diaphragm pumps are metering pumps that use a
diaphragm to isolate the operating parts from the pumped liquids, maintaining fluid purity.

Recommended Practices (IES) – Recommended Practices are issued either in the form of guidelines or a handbook
and describe preferred technical methodologies and procedures. Recommended Practices are the only authorized vehicle by which
technical guidance or philosophy may be published or presented in the name of the Institute of Environmental Sciences. (IES)
Recorders – Paper and paperless recorders provide graphic plots of measured signals. Data from temperature, humidity, pressure
and other environmental sensors may be recorded for future use.
Relative Humidity (RH) – The ratio of water vapor in the air as compared to the maximum amount of water vapor that the
air can hold. (NEBB) This changes with temperature. Warmer air can hold more water vapor.
Resistance (Filter) – The pressure drop across a filter at a stated flow and under given conditions; generally expressed in
millimeters water gauge or in SI units as N/m to the second power or Pascals. (IES)
Resistivity – A measure of the intrinsic ability of a material to conduct electrical current flow. Both conductors and non-conductors
have resistivity.
Robots/Robotic Equipment – Robots are re-programmable, multifunctional manipulators designed to move materials,
parts tools or specialized devices through variable programmed motions for the performance of a variety of tasks.
Room Construction Services – Services provided include installation, construction and renovation of cleanrooms (both
modular and conventional) and related equipment and systems.

Safety Products – Cleanroom safety include first aid stations and kits, eye wash stations, decontamination showers, emergency
personal protective equipment and other products that protect the health and safety of cleanroom workers.
Sealants – Used to seal HEPA filters into ceiling grid systems. Plastic, silicone and gel sealants are commonly used.
Semiconductor – Solid materials, such as silicone, that have a resistivity between that of a conductor and that of a resistor
materials with properties of both a conductor and insulator.
Shelving – Posts, brackets and shelves made of a variety of cleanroom compatible materials. Solid shelves, perforated shelves,
cantilevered shelves, and slanted shelves may be provided. Shelving may be freestanding or mounted onto a workstation or bench.
Shoes, Conductive – Shoes with soles of conductive materials to prevent static discharge from water.
Shoe Cleaners – Mechanical devices outside cleanrooms or air showers to clean the bottom, sides and top of shoes with a
brush system before entering the clean area.
Shoe Covers – Outer fabric covering that cover the shoe to prevent contamination from footwear. They are available in a variety
of materials and styles: spun bond polypropylene, non-skid, ESD, etc.
Signs – Cleanroom signs are used to warn of chemical hazards and proper procedures, and to identify special areas.
Skin Care Products – Hand creams and skin protectors are designed for daily use by cleanroom workers who wear rubber or
vinyl gloves that my irritate the skin. The products moisturize the hands to reduce chapping and irritation. It is extremely important for
any skin care products to free of silicone.
Smoke Sticks/ Powders – Provide a method of testing fume hood safety or HEPA filter leaks. Powders are non-toxic and
non-flammable. They are suspended to determine draft and leak locations.
Sponges/Spill Control Products – Sponge blocks, wipers, sheets and rolls are available for soaking up liquid spills or
cleaning. Many types may be reused, and are chemical-resistant and cleanroom packaged.
Standard Deviation – The positive square root of the expected value of the square of the difference between a random
variable and its mean.
Static Control Plastics – Transparent static dissipative plastic sheets are used in partitions, windows, glove boxes, and
workstations. Acrylic and polycarbonate plastics are used, and come in a variety of colors.
Static Dissipative – Able to break up, scatter or disperse stationary electrical charge resulting from friction. Has surface
resistivity of 105 to 109 to the ninth power ohms per square.
Static Meters/Sensors – Instruments and devices for measuring moisture, electrostatic fields and other parameters.
Instruments for measuring conductive devices are available.
Stationery – Stationery and documentation materials include paper, forms, notebooks, clipboards, bulletin boards, recorder
materials, envelopes, folders, labels, and tape. Stationery products are made of cleanroom compatible, non-shedding material, and
accept ink from cleanroom pen and thermal printers. Some products may be used in copy machines. Specialized cleanroom printing
services are available.
Steam Generators – Generates clean steam for cleanroom humidification, sterilizing and steam heating applications. Uses
distilled, deionized, reverse osmosis or demineralized water.
Step Stools/Ladders – Step stools have two or three steps of a specific width; ladders may have up to five steps. Steps
may be open or solid.
Sterile – Free from living microorganisms.
Sterilization Monitor – This computer-based system provides reports on the status and quality of ethylene oxide (EtO)
sterilization process conditions.
Storage Cabinets – Used to store cleanroom garments, accessories, products or supplies. Cabinets may include HEPA filters
to wash contents with clean air. Shelves are used to store accessories and supplies.
Swabs – Small pieces of cotton, foam, or other material on the end of wooden or plastic handles used to clean small objects or
in small spaces.

Tables – Freestanding, four-legged furniture that has solid or perforated tops. Vibration isolation tables provide low vertical and
horizontal frequencies for vibration control.
Testing/Certification Services – Independent, contract services for the testing and certification of HEPA filters, laminar
flow equipment, safety cabinets and HVAC systems. Certification and testing of HEPA filters includes leak testing, scanning, electrical
testing, particle count surveys, sound level measurement, vibration measurement, temperature and humidity measurement, airflow
balancing, gas system testing, light level measurement and room pressurization. Product qualification testing and environmental
analysis/testing also are available.
Thermometers – Devices used to measure temperature, and operate by means of a thermocouple (a pair of dissimilar
conductors joined in a series to form a closed circuit which produces a thermoelectric current when heated). The device measures
temperature in degrees Celsius or Fahrenheit.
Training Materials – Videos, seminars, testing courses, tapes, manuals, primers and complete programs for various
cleanroom training applications, including maintenance, preparation of a cleanroom and certification and testing.
Tubing – Stainless steel and plastic tubing used for liquid or gas handling operations.
Turnkey – A method of construction design, installation, etc. Where the contractor, installer, etc. assumes total responsibility
from design through project completion.

ULPA Filters – Ultra Low Penetration Air Filters are extended media dry filters in a rigid frame that have a minimum
particle-collection efficiency of 99.999% for particles greater than or equal to 0.12 micron in size.
Unidirectional Airflow – (Known as laminar flow) Air flowing in single pass in a single direction through a cleanroom or
clean zone with generally parallel streamlines.
USP Microbial Classification – United States Pharmacopoeia microbial classification.

Vacuum Cleaners – Used to clean surfaces through the use of suction. Cleanroom vacuum cleaners use HEPA filters to collect
particles and filter the air exhausted from the machine.
Valves – Devices that permit a flow in one direction only, or regulate the flow by opening or blocking passage; for use with liquids
and gases in pipes and tubes.
VC – Voltage contrast.
Velocity – A vector quantity which denotes, at once, the time rate and direction of a linear motion. (NEBB)
Viable Particle – A particle capable of living and growing.

Wall Systems – Upright structures consisting of interlocking individual panels, which enclose areas. They provide an airtight
environmental as well as sound and thermal insulation. Wall systems may include doors, windows, power and piping service panels
and pass-throughs.
Waste Receptacles – Containers used for disposing of contaminated waste.
Water Analyzers – Organic analyzers measure organic compounds, resistivity and temperature in high purity water.
Water Heaters – Used to heat deionized water for manufacturing applications. Most heaters use a heat exchanger that
prevents contamination of the deionized process water.
Water Purification Equipment – Used for welding and soldering applications, including assembly of high purity
piping systems.
Welding Equipment – Used for welding and soldering applications, including assembly of high purity piping systems.
Wet Process Equipment – Benches and workstations are used for manufacturing processing applications, and may feature
laminar airflow and exhaust system to remove acid fumes. They may include rinsers, hot plates, temperature baths, fire suppression
systems and sinks and tanks for specific purposes.
Wipers – Material used to wipe surfaces and absorb liquids. They may be made of foam, sponge, polyester, or a variety of
other materials.
Workstation Accessories – Components and accessories for use with workstations and benches include utility services
such as electrical, compressed air and vacuum; workstation extensions; support arms; and other accessories.
Workstations/Benches – Controlled environments around processes or work area in which the air is cleaned of particulates
by use of a HEPA/ULPA filter. Tabletop or bench top units can be placed directly on work surfaces, and are portable.
Wrist Strap Monitor – Detect faulty wrist straps and grounding cords. The cord is plugged into the monitor, which provides
audible/visual alarms to warn the user of improper grounding.
Wrist/Heel Straps – Bands worn on the wrist or over footwear which attach to grounding cords to prevent static electricity
from building up and being discharged from the body.

Source: ITW Chemtronics
This information is believed to be accurate. It is intended for professional end users having the skills to evaluate and use the data properly. ITW Chemtronics does not guarantee the accuracy of the data and assumes no liability in connection with damages incurred while using it. ©2004 Chemtronics®. All rights reserved.

Chemtronics QBE Cleaning System for End-Face Cleaning

August 20th, 2015

Using the QbE™ Cleaning System for End-Face Cleaning
1. What is the QbE Cleaning System?
The QbE Cleaning System is the precision wipe platform for cleaning fiber optic end-faces. This new fiber optic cleaning device
enables the user to clean fiber end-faces in either a “dry’ mode, or “wet” mode using a cleaning solvent, without damaging the
end-face.
2. How was the QbE Cleaning System developed?
The QbE Cleaning System was developed after three years of development with end users who expressed concerns regarding the
cleaning of end-faces. The QbE Cleaning System satisfies these concerns with an easy-to-use dispensing container, which carries
its own cleaning platen.
3. What advantages does the QbE Cleaning System have over other end-face cleaning
methods currently in use?

Features:
■ Complete fiber end-face cleaning system
■ Effective “wet” or “dry” connector cleaning
■ Provides the ideal cleaning surface
■ Convenient size
■ Heavy-duty lint-free wiping material enough for all end-face cleaning
■ Patent pending

Benefits
■ No refills to buy or investment in expensive mechanisms
■ Only system that allows both cleaning options
■ The QbE platen is perfect for outside plant and OEM applications
■ Portable cleaning system is perfect for tool kits and has best “foot print” for workbenches
■ Won’t shred or tear — tough enough to remove buffer gel, safe
■ Unique, easy-to-use cleaning device

4. How is the QbE Cleaning System constructed?
Each QbE Cleaning System contains 200 individual wipes on a roll. Each wipe is perforated for easy use and disposal, so there is always a clean wipe available for each end-face to be cleaned. The sides of the 3-inch cube container are reinforced, and each QbE Cleaning System comes with an attached neoprene cleaning platen. The cleaning platen insures that the cleaning process does not damage the fiber optic end-face.

5. How do I use the QbE Cleaning System?
Each individually packaged QbE Cleaning System contains detailed directions for four different cleaning operations. The user draws a clean QbE wipe over the cleaning platen, then follows the appropriate cleaning directions.

For “Dry” End-Face Cleaning:
■ Pull one QbE wipe over the fiber-safe neoprene platen.
■ Hold the end-face at 90 degrees, perpendicular to the platen.
■ Draw the end-face lightly over the platen in a smooth linear motion.
■ Do not press the end-face against the platen too hard.
■ Do not draw or retrace the end-face across the same area of the wipe.
■ Do not use a figure–eight motion; do not use a twist and turn motion.
■ Check your work with a fiberscope or other measuring device.

For “Wet” End-Face Cleaning:
■ Lightly spot the QbE™ wipe on the platen with Electro-Wash® PX Fiber Optic Cleaner (ES810).
■ Draw the end-face from the solvent wetted area across the dry area, using a smooth linear motion.
■ Check your work with a fiberscope or other measuring device.

For Splice Preparation:
■ Lightly moisten the QbE wipe with Electro-Wash PX Fiber Optic Cleaner and gently wipe away fiber contaminants.
■ Lightly dampen a 38540ESD swab and remove soils from the V-grooves on the fusion splicer.
For Buffer Gel Removal
■ Pull three single QbE wipes from the container.
■ Spray a small amount of Electro-Wash PX Fiber Optic Cleaner into the folded wipes.
■ Pull the cable through the first wipe and discard the wipe.
■ Repeat until the cable “squeaks” clean.

6. What makes the QbE Cleaning System unique?
The QbE Cleaning System container has double-walled, reinforced sides for extra durability, while the roll of lint-free wipes is wound around a center core that adds extra stability to the container as the roll is unwound. The large surface area of each individual QbE wipe provides enough space to clean two or even three fiber end-faces, so you can clean up to 600 end-faces with
one QbE Cleaning System. Since the cleaning platen comes new with each QbE Cleaning System purchased, there’s no chance the
platen will dry out and become hard before the unit is exhausted. This means less chance of damaging the end-face by rubbing it
across a dried-out, hardened rubber surface. The unique design of the QbE Cleaning System is currently patent pending.

7. Can cleaning solvents be used with the QbE Cleaning System?
The QbE Cleaning System is specifically designed to allow the use of solvent for a wet cleaning process, with an automatic drying
step, by drawing the end-face across the wipe from the solvent-wetted region to the dry part of the wipe. One can of Electro-Wash
PX Fiber Optic Cleaner (ES810) will deliver between 200 and 400 “shots” of cleaner, to match the 200 to 400 uses available from
each QbE wipe. Presaturated Electro-Wash MX wipes are also a good source of cleaning solvent for outside plant and in-field
service applications. Remember, it only takes a small amount of either solvent product to clean the fiber optic end-face or the
ferrule material.

8. What are the differences between reel cleaners and the QbE Cleaning System?
There are many differences between the QbE Cleaning System and other cleaning systems presently being used in the industry.
Some of the most obvious ones are:
■ Reel cleaners limit the user to a very small cleaning surface, usually only 0.75” x 1.0”, so they recommend “giving the end-face a quarter turn, then drawing it along the cleaner surface”. If there is hard grit on the end-face the “quarter turn” motion could result in scratching the end-face. The QbE Cleaning System uses a straight line cleaning motion which greatly reduces the
chance of damaging the end-face. Further, since the QbE Cleaning System is designed for use with solvent in a “wet” cleaning
process, the end-face is lubricated and less likely to be scratched. Three passes of the end-face across the QbE wipe and the
end-face is completely clean, with far less possibility of damage or scratching.

■ The conventional solvent used for cleaning end-faces is isopropyl alcohol (IPA), normally dispensed from squeeze-type
dispensers. IPA is very hydroscopic, absorbing moisture from the air very readily. The absorbed moisture dilutes the cleaner and
is then deposited on the end-face, which must then be dried. Electro-Wash PX Fiber Optic Cleaner is an aerosol package, so
there’s no way for it to be contaminated with atmospheric moisture.

■ Some reel cleaner systems advise using a “figure eight motion” when passing the end-face across the narrow cleaning window.
This motion is fine for polishing end-face surfaces, but when cleaning this motion produces drag, which can lead to linting of the cleaning surface. The larger QbE™ wipe area makes such a cleaning motion unnecessary, so there’s no chance of generating lint
when cleaning with the QbE wipe.

■ Each QbE Cleaning System carries detailed instructions for performing the four most common cleaning procedures used in the
industry. Other cleaning systems usually have separate instruction sheets, and sometimes no instructions at all.

Chemtronics Electro-Wash MX Cleaner Degreaser ES1621

August 20th, 2015

Electro-Wash® MX Cleaner Degreaser
ES1621, CP421, T021

1) What is Electro-Wash MX?
Electro-Wash MX is a brand new cleaning chemistry from ITW Chemtronics. It is a universal cleaner formulated to remove all
types of soils, very similar to Electro-Wash PX, but with a slightly slower evaporation rate. The slower evaporation allows two
things to occur:

1.) longer contact time with the soil allowing better cleaning, and
2.) lower vapor pressure allowing the product to be packaged in a presaturated wipe. Although the evaporation rate is slower than Electro-Wash PX, the evaporation rate is not as slow as Electro-Wash Two Step, or water. It is similar in evaporation rate of isopropyl alcohol with a far wider range of soil removal.

What are its features and benefits?
Electro-Wash MX is the extra-strength, plastic safe universal cleaner with a moderate evaporation time.

Its advantages over the competition are:

Features:
■ Removes organic and ionic soils
■ Easily removes flooding compounds
■ Moderate evaporation rate
■ Leaves no residue
■ Aerosol cleans soils from hard-to-reach areas
■ Presaturated wipe and tub are great for toolbox or travel

Benefits:
■ One cleaner for all soil types
■ One-step clean and dry process
■ Increased cleaning power
■ No rinsing necessary
■ Easy application for great results
■ Portability increases ease-of-use

Applications:
■ Fiber optic connectors and end faces ■ Motors and transformers
■ RF and datacom cables ■ Control systems
■ Hard-line coax cable ■ Screens and stencils
■ High voltage cables ■ Uncured epoxy
■ Metal and fiber optic cable splices ■ Metal cleaning
■ PC boards ■ Hand tools and equipment
■ Hybrid circuits ■ Service centers and service/repair vehicles
■ Electronic assemblies

2) How does the new product work in comparison to Electro-Wash PX?
The product works as well as, if not better than, Electro-Wash PX. The primary difference is that Electro-Wash MX is a slower
evaporating cleaner. Slower evaporation means that Electro-Wash MX will dissolve more deeply into the soils before it evaporates.
However, this also means that the MX will not evaporate nearly as quickly as the PX. In essence, each performs well for specific
tasks or applications — PX is specially suited where fast evaporation is required, and MX where slower evaporation is required.

3) Can I purchase Electro-Wash MX in Canada?
All Electro-Wash MX part numbers are available in Canada. These products will be available for sale and distribution throughout all North America and Asia.

4) How do I use Electro-Wash MX?
Easy. You can spray the material onto a lint free wipe such as the Chemtronics® Controlwipe™ (C910), wipe or spray directly on the part, component or cable to remove the soil. The Electro-Wash MX pre-saturated wipe is ideal for field service or where an aerosol can’t be used. The self-closing tub is ideal for service vehicles, where a technician wants the convenience of a pop-up wipe. Electro-Wash MX is designed to be easily used in many different kinds of applications.

5) Is Electro-Wash® MX flammable?
Yes. It has a flash point of 45 degrees Fahrenheit. This is higher than Electro-Wash PX’s flash point of –20 degrees Fahrenheit and in the same range as isopropyl alcohol (53 degrees) and ethanol (48 degrees).

6) Is Electro-Wash MX plastic safe?
It’s safe on most plastics. It has been tested to be safe on acrylic, polycarbonates, and also polystyrenes. However, we always
recommend testing prior to use.

7) What type of companies would be interested in these products?
The primary types of companies that would use these products include telecommunication, datacom, industrial manufacturing, OEM manufacturing, field service/maintenance businesses and businesses where there is metal cleaning of any kind.

8) How is the product packaged?
Electro-Wash MX is available in three packages. The first is a 10 oz. (307 gms) aerosol, part number ES1621, packaged 12 per case, with complete trilingual labeling for North America. The second is a presaturated wipe, part number CP421. The packet is 3.5” x 5”, with an 8” x 10” blue wipe presaturated with 9 gms of solvent. When the wipe dries out, it will turn light blue. The 9 gms of solvent enables the wipes to be shipped as non-regulated. There are 25 wipes per box, 8 boxes per case.
The third is a presaturated tub, part number T021. The tub contains a roll of 100 blue wipes, each 6” x 8.5”. Again, when the
wipe dries out, it will turn light blue. This roll of wipes is packaged in a bag within the tub that must be opened to access the
wipes. There are 6 tubs per case.

9) Can I take the products on an airplane?
The CP421 can be carried onto an airplane; however in today’s security climate you may be asked many questions regarding the
material. The rule is, if the packets contain less than 9 ml of liquid, they can be carried on board. There is no problem shipping this product by air. However, when traveling it is better to have the products air shipped to your destination. The aerosol and the tub products cannot be carried on board. Let us do the shipping. Ask your customer service person to ship samples to your destination.

CircuitWorks “The Mighty Pen”

August 19th, 2015

Frequently Asked Questions
The Mighty Pen™

1) What exactly is The Mighty Pen?
The Mighty Pen is a brand new portable cleaning tool developed, patented and marketed by ITW Chemtronics®. It is designed to easily and quickly remove all types of residue, including permanent marker, adhesives, and ink stains – all in the portability of a pen.

2) What applications does the product work with?
■ Removes adhesives, tape and label residues
■ Cleans away ink marks
■ Eliminates flux residues
■ Removes conformal coatings
■ Refurbishes telephone equipment
■ Removes adhesive residue from medical devices
■ Cleans computer and rack systems
■ Spot cleans money changing equipment
■ All repair and maintenance spot cleaning

3) Where can The Mighty Pen be used?
The Mighty Pen can be used in rework and repair applications, and in field maintenance and service. It can be used to remove adhesive residue from phone systems, remove adhesive and ink marks from mirrors and glass, remove tracking stickers from medical devices, clean away adhesive and ink residue from integrated circuits, clean stray marks on phones and money changing machines, remove tape residues from computer housings…The Mighty Pen can be used where there is a need to eradicate adhesive residues, ink marks and other difficult to remove soils.

4) What type of companies would use this product?
All companies that are involved in field service and maintenance, repair, and refurbishment would have a need for this product. Also, anybody that cannot use Menda dispensers due to spilling/portability, gallon or pint liquids due to size and safety, or anybody that cannot use alcohol due to cleaning strength.

5) How is the pen packaged?
The pen is offered with 11.5 gm of solvent/pen, on a blister card. The label is our multilingual/thirteen language CircuitWorks® label. There are 12 pens/case.

6) What are the key features and benefits of the product?

Features
■ Extra cleaning power
■ Extremely portable
■ Pen dispensing system
■ Mild citrus scent
■ Patented (US patent #6677291)
■ Cap saver barrel

Benefits
■ Quickly removes a wide range of soils
■ Can easily be carried anywhere
■ Convenient and easy to use
■ Will not overpower the end-user
■ A truly unique formulation
■ Cap loss is prevented

7) Is the product plastic safe?
This material is safe on most plastics; however it is definitely not safe for use on acrylic, styrene, and carbonate based plastics. For a more detailed list of plastic compatibility refer to the Material Compatibility Chart on the Technical Data Sheet. To be on the safe side, always test on an inconspicuous area first.

8) How do I use The Mighty Pen to remove stickers?
The Mighty Pen will not degrade most plastic coatings on pressure sensitive stickers. Once the plastic coating is peeled off, the pen is designed to remove the adhesive residue that is left behind. However, if the solvent is applied on the edge and over the surface of the sticker, the solvent system will work it’s way under the label and make it easier to peel off the plastic coating.

9) Will this product remove “Sharpie” marks/permanent marker?
This is an ideal application for The Mighty Pen. Often people are convinced that nothing will remove “that permanent marker”! And when other products are used to remove permanent marks, often the ink is incompletely removed leaving behind an image “ghost”. The Mighty Pen’s unique formula and chisel tip scrubs away ghost images quickly. Permanent markers of all types can be quickly removed from surfaces such as glass, metal, and ceramics. Always test on an inconspicuous surface before use for material incompatibility, such as plastics, antiglare coatings on glass, etc. Plastic surfaces and painted surfaces must be tested on an inconspicuous area prior to use.

10) Is it safe for use on wood furniture?
In many instances there should not be any problems. However, The Mighty Pen can remove the varnish that protects the wood,leaving the surface dull or matte. To be sure test on an inconspicuous surface before use. The same is true for fabrics; test for colorfastness before use.

11) Will it remove coffee stains?
Yes. Again, the primary question is what is the substrate you are cleaning. Substrates such as keyboards (made from ABS or polycarbonate usually) and painted surfaces may be a problem, and should be tested prior to use. Test on an inconspicuous surface before use.

12) What about conformal coatings?
The Mighty Pen will do an excellent job removing silicone, acrylic, and urethane conformal coatings. The best way to remove the coating is to uncap the pen, press the nib onto the surface to be cleaned until solvent flows from the pen, and rub the coating away. It is recommended to remove any excess coating buildup from the surface with a wipe. It is also recommended to press the nib onto a wipe several times to flush the nib clean.

13) Can The Mighty Pen remove tar?
The Mighty Pen can remove tar, and other difficult to remove soils. Always check on an inconspicuous area to test the material substrate compatibility — especially on painted items.

14) Is the product safe for use on rugs? What about fabrics?
The Mighty Pen can remove oil, lipstick, and other difficult to remove soils. Again, always check on an inconspicuous area to test the material compatibility. For rugs and fabrics it is best to depress the pen tip onto the stain and let the solvent flow over the soil. Gently rub the nib into the soil to break up the soil, and blot with a clean wipe. The wipe will pull the soils into it. Repeat until the soil is removed.

15) What happens if I get it on my hands?
The Mighty Pen is a strong cleaner, and as such will dry out the skin. We recommend to always check the MSDS before using any chemical, and to always wear the appropriate protective equipment.

16) The Mighty Pen is listed as flammable. Why?
The Mighty Pen has a flash point below 100 degrees, and is therefore listed as flammable. This is in the same range as isopropyl alcohol (rubbing alcohol) and ethanol (Bacardi Rum151). However, the main solvent in The Mighty Pen is a terpene product (d-limonene, an ultra-purified version of orange oil) that is safely used throughout the world as a cleaning product.

CircuitWorks Silicone Free Heat Sink Grease CW7270

August 19th, 2015

Frequently Asked Questions

Circuitworks® Silicone Free Heat Sink Grease, CW7270

1. What is heat sink grease?
Circuit boards produce large amounts of heat that has to be transferred from the components in order to prevent damage. This heat is usually removed by a heat sink, a component attached to the microprocessor. The better the contact between the processor and the heat sink, the faster and more efficiently the heat transfer will occur. Heat sink grease facilitates heat transfer away from electrical/electronic components by filling the voids between the surface of the component and the surface of the heat sink. The heat sink grease is produced from materials that allow heat to pass through them quickly, a quality known as thermal conductivity. These materials are blended into grease that fills the voids to improve heat transfer.

2. What is the difference between a silicone and non silicone heat sink grease?
The obvious difference is that one product contains silicone oil and the other doesn’t. Greases are made with oils and other compounds to impart the proper performance characteristics. Silicone heat sink grease contains silicone oil, which provides excellent performance in situations where high temperature stability is required. However, silicone oil can bleed from the heat sink compound, resulting in a number of negative results. The silicone oil can prevent coatings from adhering to the surface and cause insulation of contacts. It can also promote high dust accumulation. Circuitworks® Silicone Free Heat Sink Grease is formulated with an oil that provides the high temperature stability without the negatives associated with silicone-based heat sink greases.

3. How do I use heat sink grease?
Make sure the area for grease application in clean and dry. Apply a small amount of the grease to the bottom of the heat sink and spread evenly, and attach the heat sink. Remember to use as little as possible, as using too much can decrease the efficiency of the heat sink.

4. What are its features and benefits?

Features:
• Excellent thermal conductivity
• High dielectric strength/not electrically conductive
• Exceptionally low bleed

Benefits:
• Rapidly transfers heat from surfaces and components
• Will not short components
• No creep or migration over a wide temperature range

5. Does Circuitworks® Silicone Free Heat Sink Grease meet MIL-DTL-47113D, Type II?
Circuitworks® Silicone Free Heat Sink Grease exceeds the MIL-DTL-47113D Type II performance specifications.

6. How is the product packaged?
The product is packaged in a convenient syringe containing 7 grams of grease.

CircuitWorks Nickel Conductive Pen, CW2000

August 19th, 2015

Circuitworks® Nickel Conductive Pen CW2000

1. What is the Circuitworks® Nickel Conductive Pen and what does it do?
The Circuitworks® Nickel Conductive Pen is the convenient to use pen that makes instant conductive traces and coatings on circuit boards, plastic enclosures, etc. It’s good for linking components, repairing defective traces and making smooth jumpers in cost effective systems. It is also ideal for providing EMI/RFI shielding for electronic components.

2. What’s the difference between the Circuitworks® Conductive Pen and the Circuitworks®
Nickel Conductive Pen?
The Circuitworks® Conductive Pen contains a silver-based compound that is designed for the highest level of conductivity. This product is designed for circuit boards that require the most conductive trace possible. Because of the high silver content, this silver-based Conductive Pen could be cost prohibitive for some repair applications. The Nickel Conductive Pen contains nickel as its conductor. While nickel is not as conductive as silver, it does provide good conductivity for less critical repair work. It is a cost effective alternative to silver-based conductive inks. It does contain the same polymer package as our other conductive pens, so cure times are approximately the same.

3. How electrically conductive is the Circuitworks® Nickel Conductive pen in comparison to
the Circuitworks® Silver Conductive Pen?

The silver-based Circuitworks® Conductive Pen possesses a higher electrical conductivity than the Circuitworks® Nickel Conductive Pen. The conductivity is 0.02 – 0.05 ohms/sq/mil for the Circuitworks® Conductive Pen and 1.0-1.5 ohms/sq/mil for the Circuitworks® Nickel Conductive Pen.

4. What are its features and benefits?

Features:
• Single component system
• Good electrical conductivity
• Fast drying
• Highly adherent to most materials
• Low cost

Benefits:
• Easy application
• Repairs damaged circuits & shielding
• Tack free in 3 to 5 minutes
• Bonds well to circuits and housing components
• Economical solution for conductive requirements

5. How do I use the Circuitworks® Nickel Conductive Pen?
Make sure your board is clean and dry for the best adhesion. We recommend Chemtronics Electro-wash® PX Cleaner/Degreaser to remove any surface contamination that might prevent good material contact. Shake the pen vigorously for 30 seconds to insure proper dispersion of the nickel flakes. Squeeze the pen while pressing down on the surface to begin the flow. Draw the trace along the desired path. It’s best to practice with the pen before attempting detail work.

6. How long does it take the trace to dry?
The Nickel Conductive Pen trace will be tack free in 3 to 5 minutes at room temperature. Electrical conductivity is achieved within 30 minutes. You can heat cure the trace for 10-15 minutes at 80ºC to 100ºC for maximum durability and chemical resistance.

7. Does the Circuitworks® Nickel Conductive Pen require an overcoat to protect it after
it is cured?

The trace created by the Nickel Conductive Pen does need protection after curing. We recommend our Circuitworks® Overcoat Pen for the best results.

8. Can I solder to the trace of the Circuitworks® Nickel Conductive Pen?
The trace created by the Nickel Conductive Pen is not solderable. If your application requires soldering after the trace is cured, try CircuitWorks Silver Conductive Pen. It is solderable at low temperatures.

9. What is the shelf life of the Circuitworks® Nickel Conductive Pen?
Twelve (12) months from the manufacturing date stamped on the container.

CircuitWorks Flex Conductive Pen CW2900

August 19th, 2015

Frequently Asked Questions

Circuitworks® Flex Conductive Pen, CW2900

1. What is the Circuitworks® Flex Conductive Pen and what does it do?
The Circuitworks® Flex Conductive Pen makes instant, highly adherent silver traces on flexible polymeric substrates, such as Mylar and Melinex. It’s ideal for linking components, repairing defective traces and making smooth jumpers. The Flex Conductive Pen
traces also have excellent adherence to Indium Tin Oxide (or ITO).

2. What’s the difference between the Circuitworks® Conductive Pen and the Circuitworks® Flex Conductive Pen?
The Circuitworks® Conductive Pen is designed for standard circuit board repair. Its silver traces dry in minutes and have excellent adhesion to most rigid electronic materials. Flexible circuit boards are constructed with materials that allow flexibility while
retaining conductivity. The different composition of the dielectric substrates used require a different type of conductive trace, one that can adhere to these materials, contain the flexibility of the substrates and have excellent conductivity. The Flex Conductive Pen
matches these requirements in an easy to use package.

3. What are its features and benefits?
Features:

• Single component system
• Highly adherent
• Flexible polymer composition
• Excellent electrical conductivity
• Fast Drying

Benefits:
• Easy to use, no mixing
• Bonds to ITO, Mylar and Melinex
• Retains conductivity after bending
• Good for repairing defective traces
• Tack free in 5 minutes

4. How do I use the Circuitworks® Flex Conductive Pen?
Make sure your board is clean and dry for the best adhesion. We recommend Chemtronics Electro-Wash® PX Cleaner/Degreaser to remove any surface contamination that might prevent good material contact. Shake the pen vigorously for 30 seconds to insure proper dispersion of the silver flakes. Squeeze the pen while pressing down on the surface to begin the flow, then draw the trace along the desired path. It’s best to practice with the pen before attempting detail work.

5. How long does it take the trace to dry?
The Circuitworks® Flex Conductive Pen trace will be tack free in 5 minutes at room temperature. Electrical conductivity is achieved within 15 minutes. You can heat cure the trace for 15 minutes at 80ºC to 90ºC for maximum durability and chemical resistance.

6. How electrically conductive is the Circuitworks® Flex Conductive Pen in comparison to the Silver Conductive Pen?
The coatings provided by both the Circuitworks® Flex Conductive Pen and the Silver Conductive Pen exhibit excellent conductivity.
The conductivity measures 0.05 – 0.15 ohms/sq/mil for the Circuitworks® Flex Conductive Pen and 0.02-0.05 ohms/sq/mil for the Silver Conductive Pen.

7. What is the shelf life of the Circuitworks® Flex Conductive Pen?
Twelve (12) months from the manufacturing date stamped on the container.

Source: ITW Chemtronics