Concorde Electronics

Compounds

We provide indium trichloride and gallium trichloride for manufacturing common MOCVD precursor materials (TMI and TMG, respectively) for LEDs.

Indium Corporation specializes in supplying IN and Ga compounds at high purity, in large volume, and around the globe.

Thermal Interface

Indium Corporation is the world’s largest supplier of metal TIMs. We offer a wide selection of metal-based TIMs for reflow or compression. Our patented Heat-Spring^® compressible interface material at 86W/mK conductivity can solve many thermal interface issues. The standard pack for Heat-Springs^® is tape & reel and it is designed for both automated or hand assembly applications.

Our TIMs are used like a standard thermal pad. They have no residue and zero outgassing properties. Heat-Springs^® are provided in custom or standard off-the-shelf shapes.

Surface Mount Assembly and Solder Fortification

Indium solder pastes for LED deliver ultra-low voiding and clear residues.

• L-220 for Pb-free (SAC305) applications
• L-180 for Sn63 applications

Indium Corporation also provides  solder preform chips in tape & reel right off the shelf to help with solder starvation. It is easy to add bulk solder with preforms. We also provide solder preform washers and flux-coated preforms for soldering connectors to packages.

Wave Soldering Materials and Rework

• Sn995 and Sn63 Bar Solder
• WF-9940 and WF-7745 (VOC Free) Wave Flux
• Cw-207 Cored Wire—Pb and Pb-free flux-cored rework wire; clear residue; RA type flux.

Die-Attach and Fluxes

For LED companies needing high temperature die-attach materials,
Indium Corporation is a global provider of solder paste, wire, and high purity AuSn preforms for fluxless die-attach.

For companies in need of materials for bumping wafers or soldering pre-plated dies for flip-chip, Indium Corporation provides “semiconductor grade” solder pastes and fluxes.

NanoBond^®

NanoBond^®, a joining process using NanoFoil^®, is used to bond the thermal pad on LEDs to the heat-sinking substrates. NanoBond^® eliminates the need for the conventional reflow of LEDs, resulting in improved brightness and color, and extended lifetime. When combined with conventional assembly techniques, NanoBond^® produces superior thermal performances as compared to thermal epoxies.

NanoFoil^® is a self-contained, localized heat source that can be used to solder bond electronics packages to substrate materials. NanoFoil^® is a RoHS compliant material consisting of hundreds of alternating nanoscale layers of aluminum and nickel. Once activated, the heat can melt adjacent solder layers to join components together with minimal thermal exposure of the components.