Kester 24-7068-7601 SAC-305 Lead-Free Wire Solder | Sn96.5Ag3.0Cu0.5 | #275 No-Clean | .031" dia. | 2.2% Core

24-7068-7601

"275" Lead Free No-Clean Solder is designed to reduce spattering common to most core flux solders. No-clean solder eliminates the need and additional expense of residue removal while providing excellent solderability and fast wetting to a variety of surface finishes.

No need to buy in bulk quantities to get a lower price. Same Price . . . Any Quantity

Applications
• SMT and hand soldering assembly applications

SAC-305 #275 Product Performance
• Colorless translucent residue
• Excellent solderability and fast wetting to a variety of surface finishes
• Eliminates the need and expense of cleaning
• Low smoke and odor
• Low spattering
• Improves wetting performance
• Residues are non-conductive, non-corrosive

Kester 24-7068-7601 Specifications
• Alloy: Sn96.5 / Ag3.0 / Cu0.5 ( 96.5 % tin - 3% silver - 0.5% copper )
• Wire Diameter: 0.031" / 0.80mm / 21 AWG
• Melting Range: approximately 423-428º F ( 217-330º C )
• Core Flux: #275 No-Clean
• Core Size: Medium 2.2% flux by volume ( 58 )
• Spool Size: 1 lb.
• RoHS Compliant

Fluxes: If needed, Kester 959T No-clean liquid flux may be used a a compatible flux to aid in reworking soldering joints. 959T flux is available in gallon, 5-gallon and flux pen sizes.