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Kester Lead Free Wire Solder Sn96.5Ag3.0Cu0.5 (SAC305) // #275 No-Clean // .025" dia. // 2.2% Core (24-7068-7617)

Kester Lead Free Wire Solder Sn96.5Ag3.0Cu0.5 (SAC305) // #275 No-Clean //  .025

"275" Lead Free No-Clean Solder is designed to reduce spattering common to most core flux solders. No-clean solder eliminates the need and additional expense of residue removal while providing excellent solderability and fast wetting to a variety of surface finishes.

Pricing for this product is subject to change daily.

Applications
• SMT and hand soldering assembly applications

24-7068-7617 Product Performance
• Colorless translucent residue
• Excellent solderability and fast wetting to a variety of surface finishes
• Eliminates the need and expense of cleaning
• Low smoke and odor
• Low spattering
• Improves wetting performance
• Residues are non-conductive, non-corrosive

Kester 24-7068-7617 Specifications
• Wire Diameter: .025", 0.64mm (23 gauge)
• Alloy: SN96.5 / AG3.0 / CU0.5 (96.5 % tin, 3% silver, 0.5% copper)
• Melting Range: approximately 423-428º F, 217-330º C
• Core Flux: No Clean
• Core Size: 58 (Medium Core 2.2% flux)
• Spool Size: 1 lb.
• RoHS Compliant

Fluxes: If needed, Kester 959T No-clean liquid flux may be used a a compatible flux to aid in reworking soldering joints. 959T flux is available in gallon, 5-gallon and flux pen sizes.

Price $55.45