Kester 24-6337-8850 Wire Solder | Sn63Pb37 (63-37) | #245 No-Clean | Sn63Pb37 (63-37) | .010" Dia | 2.2% Core (58) | New Old Stock

Kester 24-6337-8850 • New Old Stock

Inventory: 74

!<<span style='font-size: 14px;'>>!!"245" No-Clean Flux Solder will create visually acceptable assemblies without the need and expense of cleaning. Solderability and efficiency are comparable to that of mildly activated rosin flux (RMA). Residues are non-corrosive, non-conductive and do not require removal in most applications.

No need to buy in bulk quantities to get a lower price. Same Price . . . Any Quantity



• Alloys: Sn63Pb37 (63% tin - 37% lead)
• Wire Diameter: .010"
• Flux: #245 No-Clean
• Core size: medium 2.2% by volume (58)
• DOM: Aug 2018

• Compatible metals: Platinum, gold, copper, tin, solder and silver.

Sn63 Pb37 ( 63-37 ) #245 Product Performance
• Most common tin-lead eutectic used in pcb assembly applications
• Non-corrosive, non-conductive post-soldering residue
• Residues are kept to a minimum
• Compatible with leaded and lead-free alloys
• Most applications do not require residue removal

Kester 24-6337-8843 Specifications:
• New Old Stock
• Kester P/N: 24-6337-8843
• Alloy: Sn63 / Pb37 ( 63% tin - 37% lead )
• Wire Diameter: .010"
• Core Flux: #245 No-Clean
• Core Size : small 2.2% by weight ( 58 )
• Spool Size: 1 lb.
• Melting Point: 361º F ( 183º C )
• DOM: 2018
• Case qty: 25 lbs.
• Classified as ROL0 pr J-STD-006C
• Compliant to Bellcore GR-78
• RoHS Compliant: No

Fluxes: If needed, Kester 951 No-Clean flux may be used as an aid in reworking soldered joints. Available in gallon, 5-gallon and flux pen sizes for optimum board cleanliness.