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Kester Lead-Free Silver-Free Sn99.3Cu.07 (K100LD) // #275 No-Clean // .062" dia. // 3.3% core (24-9574-7615)

Kester Lead-Free Silver-Free Sn99.3Cu.07 (K100LD) // #275 No-Clean // .062

Low cost alternative to SAC-305

K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging.

Pricing for this product is subject to change daily.

K100LD SN99.3 CU.07 24-9574-7615 Features
• Lower cost than SAC305
• Prevent copper erosion and yield consistent soldering results
• Designed to give excellent wetting to through-hole and bottom side SMT components
• Compatible with lead-free and leaded alloys
• Low smoke and odor
• Low spattering
• Produces shiny, smooth solder joints
• Dross-reducing technology results in 20% lower dross formation

Kester 275 No-Clean Flux
"275" Lead Free No-Clean Solder is designed to reduce spattering common to most core flux solders. No-clean solder eliminates the need and additional expense of residue removal while providing excellent solderability and fast wetting to a variety of surface finishes.

• Tin: 99.3%, Silver : 0%, Copper: 0.7%
• Contains Nickel and Bismuth
• Melt Point: ~227° C
• Appearance: Shiny
• Shrink Holes: No
• Copper Dissolution: (Sn63=1): 0.8
• Size: 1 lb. Spool

Price $33.50