K100LD Bar Solder is a eutectic Tin-Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging.
• Low cost alternative to SAC-305Pricing for this product is subject to change dailyFeatures• Lower cost than SAC-305
• Lowest dissolution of Copper
• Prevents copper erosion and yields consistent soldering results
• Designed to give excellent wetting to through-hold and bottom-side SMT components
• Low Dross: 20% lower dross formation
• Low dullness. Shiny smooth solder joints
Specifications K100LD Bar Solder:• Quantity: 25-lbs.
• Weight per bar: 1-2/3 lbs.
• Melting Point: ~227°C (441° F)
Ordering Options•
Order Solder by the Bar 
