The conveniently packaged no-clean flux gel formulated for easy BGA rework.
Circuit board repair and prototyping is faster, easier and more accurate. Advanced-formula materials packaged in unique delivery systems ensure superior performance and pinpoint accuracy.

CW8500 Features
•  Syringe applicator provides exact delivery of flux to surface
• Long tack time, extended shelf life
•  No refrigeration required
•  Noncorrosive, halide and halogen free
•  Excellent consistency with stable viscosity
•  RoHS Compliant

Specifications
•  Meets IPC requirements for ROL0, No Clean
•  Conforms to ISO 9454
•  Meets Bellcore TR-NWT-000078 requirements
•  Meets DIN EN 29454-1 1.1.3.C classification