The conveniently packaged flux gel formulated for easy lead-free BGA rework
Circuit board repair and prototyping is faster, easier and more accurate. Advanced-formula materials packaged in unique delivery systems ensure superior performance and pinpoint accuracy.

CW8700 Features
•  Specifically formulated for the higher temperature requirements of lead free applications
•  Syringe applicator provides exact delivery of flux to surface
•  Long tack time, extended shelf life
•  No refrigeration required
•  Noncorrosive, halide and halogen free
•  Excellent consistency with stable viscosity
•  RoHS Compliant

Specifications
•  Conforms to ISO 9454
• Meets IPC requirements for R0L0, No Clean
•  Meets DIN EN 29454-1 1.1.3.C classification
• Size: 3.5 g (0.12 oz.)