The conveniently packaged flux gel formulated for easy lead-free BGA rework
Circuit board repair and prototyping is faster, easier and more accurate. Advanced-formula materials packaged in unique delivery systems ensure superior performance and pinpoint accuracy.
CW8700 Features
• Specifically formulated for the higher temperature requirements of lead free applications
• Syringe applicator provides exact delivery of flux to surface
• Long tack time, extended shelf life
• No refrigeration required
• Noncorrosive, halide and halogen free
• Excellent consistency with stable viscosity
• RoHS Compliant
Specifications
• Conforms to ISO 9454
• Meets IPC requirements for R0L0, No Clean
• Meets DIN EN 29454-1 1.1.3.C classification
• Size: 3.5 g (0.12 oz.)



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