Kester 24-9574-7615 • A Low Cost Alternative to SAC-305

K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging.

“275” Lead Free No-Clean Solder is designed to reduce spattering common to most core flux solders. No-clean solder eliminates the need and additional expense of residue removal while providing excellent solderability and fast wetting to a variety of surface finishes.

No need to buy in bulk quantities to get a lower price. Same Price . . . Any Quantity

K100LD Sn99.3 Cu.07 24-9574-7615 Features

• Lower cost than SAC-305
• Prevent copper erosion and yield consistent soldering results
• Designed to give excellent wetting to through-hole and bottom side SMT components
• Compatible with lead-free and leaded alloys
• Low smoke and odor
• Low spattering
• Contains Nickel and Bismuth
• Produces shiny, smooth solder joints
• No sink holes
• Dross-reducing technology results in 20% lower dross formation

Specifications:

• Alloys: Tin 99.3% – Copper 0.7%
• Wire Diameter: 0.062″ / 1.50mm / 16 AWG
• Flux: #275 No-Clean
• Core Size: regular 3.3% flux by volume ( 66 )
• Melting Point: ~227° C
• Copper Dissolution: (Sn63=1): 0.8
• Size: 1 lb. Spool