Kester Option-C Solder Analysis

The fast-track method for solder analysis. Kester’s solder analysis program is a prepaid method for rapid response solder sample analysis. Take a solder sample directly from a wave soldering machine or from a pot after thorough mixing.  Use this Solder Analysis Test for all brands of solder.

Option-C Features:

• This solder testing kit can used with all brands of solder
• Test for solder pot contamination and wave solder machine imbalances
• Test includes all metals specified in J-STD-006C. This includes Tin (Sn), Lead (Pb), Silver (Ag), Copper (Cu), Bismuth (Bi), Antimony (Sb),  Aluminum (Al), Arsenic (As), Gold (Au), Cadmium (Cd), Iron (Fe), Indium (In), Nickel (Ni) and Zinc (Zn). Lead is measured and reported when at the impurity level but reported as ” Balance” in traditional leaded alloys.
• Avoid soldering problems such as icicling, bridging, pin-holing, webbing, dull connections and grittiness.
• Each analytical report is reviewed by the Analytical Laboratory to determine the quality of the solder.
• The analytical report is usually e-mailed within 48 hours of receipt of the solder sample.

Option-C Specifications
• Report is in compliance with MIL-STD-454, WS6536, DOD-2000 and IPC-S-815

Option-C Contents:
• Sample-mailer envelope includes documentation, shipping label and instructions for sending the solder sample.

• Ship the envelope with the solder sample in a sturdy box.