Kester 70-1903-0811 (Old #57-3843-8113) lead free, organic acid, water-soluble solder paste formula is specifically designed for use with the higher temperature PB-Free alternative soldering alloys such as Sn96.5 Ag3.0 Cu 0.5 (SAC Alloys).  See shipping information

Features & Benefits:
• Residues are easily removed with hot DI water
• Reduces scrap due to less paste dry-out.
• Stable tack life to long stencil life
• Consistent printing over a range of temperatures and humidities
• Excellent wetting onto Ag/Pb leaded components

Specifications:
• Kester P/N: 70-1903-0811 (Old P/N: 57-3843-8113)
• Alloy: Sn96.5 Ag3.0 Cu0.5 (96.5% tin / 3.0% silver  / .5% copper)
• Print speed up to 150 mm/sec (6 in/sec)
• Type: 3
• Metals: 89.5%
• RoHS compliant 2002/95/EC Article 4.
• Classified as ORH0 per J-STD-004
• Must be refrigerated

Shipping/Ordering Information
• Overnight: Perishable products ship via UPS-Red Next Day Air delivery (most zip codes)
• Ground: Shipments within 1-day delivery from South Hackensack, NJ (Zip Code 07606) can ship via UPS ground