Soder-Wick® No-Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Finely braided, unique geometric design of the pure copper braid significantly reduces rework and repair time and minimizes the risk of heat damage to the board. The braid is coated with pure water white rosin flux, requiring little or no post-solder cleaning making the No Clean Braid virtually residue free, leaving boards cleaner.

Applications
• Small pads, SMDs.

Soder-Wick 60-2-10 Features:
• Patented noncorrosive, halide free, organic no-clean flux
• No-clean formula leaves boards cleaner
• Pure, oxygen free copper braid
• Reduce rework and repair time
• Minimize the risk of heat damage to the board
• Unique geometric weave of the braid optimizes heat transfer into the solder joint
• ESD-safe static dissipative spool

Soder-Wick No-Clean Specifications
• Braid Size: #2 Yellow
• Braid Width: .060″ (1.5mm)
• Braid Length: 10 ft.
• Flux type: No clean
• Manufacturers Standard Pack: 25 pcs
• Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance