EnviroMark EM907 is a lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys. Compatible to lead free alloys including Sn96.5Ag3.0Cu0.5 (SAC alloy). The residue does not need to be removed for typical applications.  See shipping information.

Features and Benefits:
• No-clean formula does not leave a residue ( typical applications)
• Stable tack life
• Produce lead-free joints that closely resemble those achieved with SN/PB solder paste
• Solder a wide variety of surface metallizations including Ni/Au, ImSn, ImAg
• Capable of 60 minute break times in printing
• RoHs compliant

• See ” Shipping Information” below to determine the UPS shipping option that is required for your Zip Code

Kester Enviro-Mark 907 Specifications:
• Kester P/N: 70-0605-0811 (Old 57-3403-9913)
• Alloy: Sn96.5 Ag3.0 Cu.05
• Metals: 88.5%
• Type 3
• Mesh size: -325+500
• Fine pitch continual printability: 0.4mm/16mils
• High print speeds: up to 6″/s (150 mm/s)
• Stencil life: 12+ hours (process dependent)
• Classified as ROL0 per J-STD-004
• Refrigeration required

Ordering-Shipping Information
• Overnight: Perishable products ship via UPS-Red Next Day Air delivery (most zip codes)
• Ground: Shipments within 1-day delivery from South Hackensack, NJ (Zip Code 07606) can ship via UPS ground