NXG1 is a lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys. Compatible to lead free alloys including Sn96.5Ag3.0Cu0.5. The residue does not need to be removed for typical applications. NXG1 has a lengthy 8 month shelf life.  See shipping information

Features & Benefits:
• Kester P/N: 70-3213-0811
• No-clean formula does not leave a residue ( typical applications)
• Produce smooth, shiny joints that closely resemble those achieved with SN/PB solder paste
• Long stencil and tack life (process dependent)
• Excellent release from stencil
• Capable of 120 minute break times in printing
• Refrigeration required

NXG1 Specifications
• Alloy: Sn96.5 Ag3.0 Cu0.5 (96.5% tin / 3.0% silver / 0.5% copper)
• Metals: 88.5%
• Flux type: no-clean
• Mesh: -325 +500
• Print speeds up to 200 mm/sec (8 in/sec)
• Excellent printing characteristics on 0.4mm (16 mil) pitch QFPs
• Shelf life: 8 months
• RoHs compliant

Ordering-Shipping Information
• Overnight: Perishable products ship via UPS-Red Next Day Air delivery (most zip codes)
• Ground: Shipments within 1-day delivery from South Hackensack, NJ (Zip Code 07606) can ship via UPS ground