Kester 186/G rosin flux has been developed for use in critical applications where difficult assemblies are to be soldered but processs requirements stipulate use of Type RMA flux. There is no surface insulation resistance degradation caused by the flux residue. The flux residue is also moisture and fungus resistant.

Features and Benefits
• Flux residue is non-corrosive and non-conductive.
• Solder multi-layer assemblies which require a high preheat temperature.
• Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents
• Residue will not degrade surface insulation and resists moisture and fungus.
• Minimal ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications
• Buy a case of 4 gallons and pay the same HazMat fee.

Specifications:
• Kester Part No. 63-0000-0186
• Specific gravity: 0.874-0.884
• Solids (typical): 36%
• Flash point: 18° C (64° F)55.5
• Acid number (typical): 55.5 +/- 7.8 mg KOH/g of flux
• Under MIL-F-14256, was QPL approved as Type RMA
• HazMat classification: UN1219

Hazardous Materials Shipping
• UPS HazMat shipping charges to be determined.
• HazMat items will be condensed into as few packages as possible to minimize the UPS HazMat fees.