Kester 24-9574-6401 • A Low Cost Alternative to SAC-305

K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging.
Kester “331” Organic water-soluble flux is more effectivee than rosin flux when working with difficult-to-solder metals. Organic flux is more heat stable than most organic fluxes and the residue can be completely removed with a simple water rinse

No need to buy in bulk quantities to get a lower price. Same Price . . . Any Quantity

K100LD Sn99.3 Cu.07 24-9574-6401 Features
• Lower cost than SAC-305
• Contains nickel and bismuth
• Prevent copper erosion and yield consistent soldering results
• Designed to give excellent wetting to through-hole and bottom side SMT components
• Dross-reducing technology results in 20% lower dross formation
• No Sink Holes
• Contains Nickel and Bismuth
• Produces shiny, smooth solder joints

Specifications:
• Alloys: Tin 99.3% – Copper 0.7%
• Wire Diameter: .020″ / 0.50mm / 25 AWG
• Flux: #331 Organic Water Soluble
• Core Size: regular 3.3% flux by volume ( 66 )
• Contains Nickel and Bismuth
• Melting Point: ~227° C
• Copper Dissolution: (Sn63=1): 0.8
• Size: 1 lb. Spool