“245” No-Clean Flux Solder will create visually acceptable assemblies without the need and expense of cleaning. Solderability and efficiency are comparable to that of mildly activated rosin flux (RMA). Residues are non-corrosive, non-conductive and do not require removal in most applications.

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Sn63 Pb37 ( 63-37 ) #245 Product Performance
• Most common tin-lead eutectic used in pcb assembly applications
• Non-corrosive, non-conductive post-soldering residue
• Residues are kept to a minimum
• Compatible with leaded and lead-free alloys
• Most applications do not require residue removal

• Compatible metals: Platinum, gold, copper, tin, solder and silver.

Kester 24-6337-8800 Specifications:
• Alloy: Sn63 / Pb37 ( 63% tin – 37% lead )
• Wire Diameter: .031″/ 0.80mm / 21 AWG
• Flux: #245 No-Clean
• Core Size: regular 3.3% flux by weight (#66)
• Spool Size: 1 lb.
• Melting Point: 361º F (183º C)
• Case qty: 25 lbs.
• Classified as ROL0 pr J-STD-006C
• Compliant to Bellcore GR-78

Fluxes: If needed, Kester 951 No-Clean flux may be used as an aid in reworking soldered joints. Available in gallon, 5-gallon and flux pen sizes for optimum board cleanliness.